Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056369 | Substrate holding apparatus | — | 2021-07-06 |
| 8735737 | Substrate having leads | Yoshihiro Ihara, Takehito Terasawa | 2014-05-27 |
| 8674499 | Heat radiation component and semiconductor package including same | Kei Murayama, Shigeaki Suganuma, Ryuichi Matsuki, Hiroyuki Miyajima | 2014-03-18 |
| 8314349 | Lead pin and wiring substrate with lead pin, and method of manufacturing the same | — | 2012-11-20 |