Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8693211 | Wiring substrate and semiconductor device | — | 2014-04-08 |
| 7825499 | Semiconductor package and trenched semiconductor power device using the same | — | 2010-11-02 |
| 7160796 | Method for manufacturing wiring board and semiconductor device | — | 2007-01-09 |
| 6518672 | Multi-layer wiring board substrate and semiconductor device using the multi-layer wiring substrate | Takashi Kurihara, Michio Horiuchi, Shigeru Mizuno | 2003-02-11 |