Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12160954 | Wiring board having a wiring pattern that has a multi-layer structure | — | 2024-12-03 |
| 10366949 | Wiring substrate and semiconductor device | Noriyoshi Shimizu, Jun Furuichi, Akio Rokugawa, Takashi Ito | 2019-07-30 |
| 10262946 | Wiring substrate and semiconductor device | Yuta Sakaguchi, Norikazu Nakamura, Noriyoshi Shimizu | 2019-04-16 |
| 10028393 | Wiring substrate and semiconductor package | Noriyoshi Shimizu, Akio Rokugawa | 2018-07-17 |
| 9961760 | Wiring substrate | Yuta Sakaguchi, Noriyoshi Shimizu | 2018-05-01 |
| 9875957 | Wiring substrate and semiconductor device | Noriyoshi Shimizu, Jun Furuichi, Akio Rokugawa, Takashi Ito | 2018-01-23 |
| 9741652 | Wiring substrate | Yuta Sakaguchi, Noriyoshi Shimizu | 2017-08-22 |