Issued Patents All Time
Showing 51–57 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6764931 | Semiconductor package, method of manufacturing the same, and semiconductor device | Takahiro Iijima, Noriyoshi Shimizu | 2004-07-20 |
| 6754952 | Process for manufacturing multiple layer wiring substrate onto which thin film capacitor is incorporated | Akihito Takano, Akira Fujisawa | 2004-06-29 |
| 6441314 | Multilayered substrate for semiconductor device | Masayuki Sasaki, Yuichi Matsuda | 2002-08-27 |
| 6434819 | Production of multilayer circuit board | — | 2002-08-20 |
| 6418615 | Method of making multilayered substrate for semiconductor device | Masayuki Sasaki, Yuichi Matsuda | 2002-07-16 |
| 6340841 | Build-up board package for semiconductor devices | Takahiro Iijima | 2002-01-22 |
| 4721878 | Charged particle emission source structure | Hirotoshi Hagiwara, Naoyuki Okamoto, Tsunemasa Inoue | 1988-01-26 |