OU

Osamu Uehara

SI Seiko Instruments: 8 patents #205 of 1,437Top 15%
GL Glory: 5 patents #53 of 385Top 15%
NC Nkk Co.: 3 patents #209 of 1,173Top 20%
SC Shinko Electric Industries Co.: 2 patents #315 of 723Top 45%
AC Alcare Co.: 1 patents #14 of 47Top 30%
GL Gunze Limited: 1 patents #132 of 349Top 40%
Overall (All Time): #220,739 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Showing 1–20 of 20 patents

Patent #TitleCo-InventorsDate
11445931 Operation processing apparatus calculating numerical value representing skin barrier function, equipment, computer readable medium, and method for evaluating skin barrier function Kenichi MATSUZAKI, Takao Nakamura, Toshimasa KUSUHARA 2022-09-20
10275974 Paper sheet handling apparatus Fumiaki Koga, Akira Hibino 2019-04-30
9598190 Paper sheet bundling apparatus Tsuyoshi Hodatsu, Tomomi Inoue 2017-03-21
8978970 Banknote processing apparatus and banknote bundle dispensing method Hiroshi Nobuhara 2015-03-17
8872490 Voltage regulator Kiyoshi Yoshikawa 2014-10-28
8416591 DC-DC converter with soft start circuit 2013-04-09
7967125 Deformed-coin detector Takashi Ishimatsu, Satoru Katori, Kazuyuki Shimizu, Yasushi Hiraoka 2011-06-28
7868686 Band gap circuit 2011-01-11
7800433 Power supply switching circuit Kiyoshi Yoshikawa, Fumiyasu Utsunomiya, Toshiyuki Tsuzaki, Hiroyuki Masuko, Hiroki Wake +1 more 2010-09-21
7777472 Current detector circuit and current mode switching regulator 2010-08-17
7766229 Bill/coin processing system Takashi Ishimatsu, Kazuyuki Shimizu, Kazuhiro Doi, Koichi Nishida 2010-08-03
7615973 Adder and current mode switching regulator 2009-11-10
7599052 Method for marking defect and device therefor Mitsuaki Uesugi, Shoji Yoshikawa, Masaichi Inomata, Tsutomu Kawamura, Takahiko Oshige +11 more 2009-10-06
7514988 Band gap constant-voltage circuit 2009-04-07
7423744 Method for marking defect and device therefor Mitsuaki Uesugi, Shoji Yoshikawa, Masaichi Inomata, Tsutomu Kawamura, Takahiko Oshige +11 more 2008-09-09
7248366 Method for marking defect and device therefor Mitsuaki Uesugi, Shoji Yoshikawa, Masaichi Inomata, Tsutomu Kawamura, Takahiko Oshige +11 more 2007-07-24
6815773 Semiconductor device and method of manufacturing the same Jun Osanai 2004-11-09
6380061 Process for fabricating bump electrode Syoichi Kobayashi, Naoyuki Koizumi, Hajime Iizuka 2002-04-30
6198169 Semiconductor device and process for producing same Syoichi Kobayashi, Naoyuki Koizumi, Hajime Iizuka 2001-03-06
4861409 Process and apparatus for forming laminate by thermocompression bonding Kenji Hashida, Takeshi Yamamoto, Tatsuya Fukumoto, Tetsuji Deguchi, Shigeyuki Hirata +1 more 1989-08-29