Issued Patents All Time
Showing 26–50 of 117 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8299623 | Semiconductor package | Yuichi Taguchi | 2012-10-30 |
| 8212365 | Printed wiring board and manufacturing method thereof | Keisuke Ueda | 2012-07-03 |
| 8212355 | Semiconductor package and manufacturing method of the semiconductor package | Yuichi Taguchi | 2012-07-03 |
| 8183679 | Electronic part package | Hideaki Sakaguchi, Mitsutoshi Higashi | 2012-05-22 |
| 8183469 | Wiring board and method of manufacturing the same | Kei Murayama, Takaharu Yamano | 2012-05-22 |
| 8148738 | Semiconductor device having an element mounted on a substrate and an electrical component connected to the element | Kei Murayama, Mitsutoshi Higashi, Naoyuki Koizumi, Yuichi Taguchi, Akinori Shiraishi | 2012-04-03 |
| 8137497 | Method of manufacturing wiring substrate | Kei Murayama, Mitsutoshi Higashi, Hideaki Sakaguchi | 2012-03-20 |
| 8119932 | Wiring board and method of manufacturing the same | — | 2012-02-21 |
| 8111523 | Wiring board with switching function and method of manufacturing the same | Kei Murayama | 2012-02-07 |
| 8108993 | Method of manufacturing wiring substrate, and method of manufacturing semiconductor device | Mitsutoshi Higashi, Kei Murayama, Hideaki Sakaguchi | 2012-02-07 |
| 8106484 | Silicon substrate for package | Akinori Shiraishi, Kei Murayama, Yuichi Taguchi, Mitsutoshi Higashi | 2012-01-31 |
| 8100555 | Lighting apparatus | Mitsutoshi Higashii, Kei Murayama, Yuichi Taguchi, Akinori Shiraishi | 2012-01-24 |
| 8080122 | Method of manufacturing wiring substrate and method of manufacturing semiconductor device | Kei Murayama, Mitsutoshi Higashi, Hideaki Sakaguchi | 2011-12-20 |
| 8062927 | Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same | Kiyoshi Ol | 2011-11-22 |
| 8053886 | Semiconductor package and manufacturing method thereof | Yuichi Taguchi, Mitsutoshi Higashi, Akinori Shiraishi, Hideaki Sakaguchi | 2011-11-08 |
| 8044429 | Light-emitting device and method for manufacturing the same | Mitsutoshi Higashi, Yuichi Taguchi, Akinori Shiraishi, Kei Murayama, Naoyuki Koizumi +1 more | 2011-10-25 |
| 8008120 | Method for producing electronic part package | Hideaki Sakaguchi, Mitsutoshi Higashi | 2011-08-30 |
| 8003895 | Electronic parts packaging structure and method of manufacturing the same | Kei Murayama, Hiroyuki Kato, Syoji Watanabe | 2011-08-23 |
| 7989927 | Silicon substrate for package | Akinori Shiraishi, Kei Murayama, Yuichi Taguchi, Mitsutoshi Higashi | 2011-08-02 |
| 7981798 | Method of manufacturing substrate | Yuichi Taguchi, Akinori Shiraishi, Kei Murayama, Hideaki Sakaguchi, Mitsutoshi Higashi | 2011-07-19 |
| 7964950 | Electronic parts packaging structure and method of manufacturing the same | Kei Murayama, Toshinori Koyama, Kazutaka Kobayashi, Mitsutoshi Higashi | 2011-06-21 |
| 7960820 | Semiconductor package | Akinori Shiraishi, Kei Murayama, Yuichi Taguchi, Mitsutoshi Higashi | 2011-06-14 |
| 7952191 | Semiconductor device | Mitsutoshi Higashi | 2011-05-31 |
| 7948092 | Electronic component and method for manufacturing the same | Kei Murayama, Yuichi Taguchi, Akinori Shiraishi, Mitsutoshi Higashi | 2011-05-24 |
| 7897510 | Semiconductor device package, semiconductor apparatus, and methods for manufacturing the same | Kei Murayama, Akinori Shiraishi, Yuichi Taguchi, Naoyuki Koizumi, Mitsutoshi Higashi | 2011-03-01 |