Issued Patents All Time
Showing 76–100 of 117 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7678685 | Interposer and method for producing the same and electronic device | Yuichi Taguchi | 2010-03-16 |
| 7667474 | Probe device | Mitsutoshi Higashi | 2010-02-23 |
| 7655956 | Semiconductor device and method for manufacturing the same | Mitsutoshi Higashi, Yuichi Taguchi, Hideaki Sakaguchi, Akinori Shiraishi, Naoyuki Koizumi +1 more | 2010-02-02 |
| 7656023 | Electronic parts packaging structure and method of manufacturing the same | Mitsutoshi Higashi, Akinori Shiraishi | 2010-02-02 |
| 7640655 | Electronic component embedded board and its manufacturing method | — | 2010-01-05 |
| 7622747 | Light emitting device and manufacturing method thereof | Yuichi Taguchi, Hideaki Sakaguchi, Naoyuki Koizumi, Mitsutoshi Higashi, Akinori Shiraishi +1 more | 2009-11-24 |
| 7605080 | Semiconductor device and method of manufacturing the same | Naoyuki Koizumi | 2009-10-20 |
| 7605463 | Interposer and method for producing the same and electronic device | Yuichi Taguchi | 2009-10-20 |
| 7592700 | Semiconductor chip and method of manufacturing semiconductor chip | Mitsutoshi Higashi | 2009-09-22 |
| 7576004 | Semiconductor chip and method of manufacturing semiconductor chip | Mitsutoshi Higashi | 2009-08-18 |
| 7573135 | Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film | Kei Murayama, Mitsutoshi Higashi, Toshinori Koyama | 2009-08-11 |
| 7563987 | Electronic parts packaging structure and method of manufacturing the same | Kei Murayama, Hiroyuki Kato, Syoji Watanabe | 2009-07-21 |
| 7557450 | Wiring substrate and electronic parts packaging structure | Kei Murayama | 2009-07-07 |
| 7557037 | Method of manufacturing semiconductor chip | — | 2009-07-07 |
| 7545049 | Electronic parts packaging structure | Kei Murayama, Toshinori Koyama, Kazutaka Kobayashi, Mitsutoshi Higashi | 2009-06-09 |
| 7530163 | Electronic parts packaging structure and method of manufacturing the same | Kei Murayama, Naohiro Mashino, Mitsutoshi Higashi | 2009-05-12 |
| 7524753 | Semiconductor device having through electrode and method of manufacturing the same | Mitsutoshi Higashi, Akinori Shiraishi, Hideaki Sakaguchi | 2009-04-28 |
| 7507602 | Semiconductor device and method of manufacturing the same | — | 2009-03-24 |
| 7508057 | Electronic component device | Akinori Shiraishi, Kei Murayama, Yuichi Taguchi, Mitsutoshi Higashi | 2009-03-24 |
| 7498200 | Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film | Kei Murayama, Mitsutoshi Higashi, Toshinori Koyama | 2009-03-03 |
| 7494898 | Method for manufacturing semiconductor device | Yuichi Taguchi, Akinori Shiraishi, Naoyuki Koizumi, Kei Murayama, Hideaki Sakaguchi +1 more | 2009-02-24 |
| 7488094 | Semiconductor device and manufacturing method of semiconductor device | Kei Murayama, Akinori Shiraishi, Naoyuki Koizumi, Hideaki Sakaguchi, Mitsutoshi Higashi +1 more | 2009-02-10 |
| 7470891 | Optical device | Naoyuki Koizumi, Akinori Shiraishi, Yuichi Taguchi, Kei Murayama, Hideaki Sakaguchi +1 more | 2008-12-30 |
| 7420128 | Electronic component embedded substrate and method for manufacturing the same | Mitsutoshi Higashi, Kei Murayama, Hiroyuki Kato | 2008-09-02 |
| 7378732 | Semiconductor package | Takaharu Yamano, Takako Yoshihara | 2008-05-27 |