Issued Patents All Time
Showing 101–117 of 117 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7285728 | Electronic parts packaging structure and method of manufacturing the same | Kei Murayama, Hiroyuki Kato, Syoji Watanabe | 2007-10-23 |
| 7285862 | Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film | Kei Murayama, Mitsutoshi Higashi, Toshinori Koyama | 2007-10-23 |
| 7279771 | Wiring board mounting a capacitor | Kei Murayama, Mitsutoshi Higashi, Toshio Gomyo, Yukiharu Takeuchi | 2007-10-09 |
| 7217888 | Electronic parts packaging structure and method of manufacturing the same | Kei Murayama, Naohiro Mashino, Mitsutoshi Higashi | 2007-05-15 |
| 7214565 | Manufacturing method of an electronic part built-in substrate | — | 2007-05-08 |
| 7198986 | Electronic parts built-in substrate and method of manufacturing the same | — | 2007-04-03 |
| 7195988 | Semiconductor wafer and method of manufacturing a semiconductor device using a separation portion on a peripheral area of the semiconductor wafer | Yoshihiko Nemoto, Kenji Takahashi | 2007-03-27 |
| 7183647 | Wiring substrate and electronic parts packaging structure | Kei Murayama | 2007-02-27 |
| 7134195 | Method of production of multilayer circuit board with built-in semiconductor chip | Kei Murayama, Mitsutoshi Higashi | 2006-11-14 |
| 7122901 | Semiconductor device | Keisuke Ueda | 2006-10-17 |
| 7084006 | Electronic parts packaging structure and method of manufacturing the same | Kei Murayama, Mitsutoshi Higashi | 2006-08-01 |
| 7084009 | Method of manufacturing a packaging structure for electronic parts buried in an insulating film formed on the electronic parts and a wiring substrate | Kei Murayama, Naohiro Mashino, Mitsutoshi Higashi | 2006-08-01 |
| 7057290 | Electronic parts packaging structure and method of manufacturing the same | Kei Murayama, Toshinori Koyama, Kazutaka Kobayashi, Mitsutoshi Higashi | 2006-06-06 |
| 6958544 | Semiconductor device and method of manufacturing the same | — | 2005-10-25 |
| 6943442 | Electronic parts packaging structure having mutually connected electronic parts that are buried in a insulating film | Kei Murayama, Naohiro Mashino, Mitsutoshi Higashi | 2005-09-13 |
| 6930392 | Electronic parts packaging structure and method of manufacturing the same | Kei Murayama, Mitsutoshi Higashi | 2005-08-16 |
| 6875672 | Method of manufacturing a semiconductor device with penetration electrodes that protrude from a rear side of a substrate formed by thinning the substrate | Yoshihiko Nemoto, Tomonori Fujii, Tomotoshi Sato | 2005-04-05 |