Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12185470 | Embedded printed circuit board | Takashi Kurihara, Kiyoshi Oi | 2024-12-31 |
| 11955410 | Electronic component apparatus having a first lead frame and a second lead frame and an electronic component provided between the first lead frame and the second lead frame | Yasushi Araki, Akinobu Inoue, Tsukasa Nakanishi | 2024-04-09 |
| 11929342 | Semiconductor device with leads having step surfaces | Futoshi Tsukada, Yoshiyuki Sawamura | 2024-03-12 |
| 11552004 | Wiring structure having stacked first and second electrodes | Takayuki Matsumoto, Tsukasa Nakanishi | 2023-01-10 |
| 11452210 | Wiring substrate and electronic device | Takayuki Matsumoto, Tsukasa Nakanishi | 2022-09-20 |
| 11444006 | Electronic component apparatus having a first lead frame and a second lead frame and an electronic component provided between the first lead frame and the second lead frame | Yasushi Araki, Akinobu Inoue, Tsukasa Nakanishi | 2022-09-13 |
| 10818580 | Electronic component device | — | 2020-10-27 |
| 9490233 | Fingerprint recognition semiconductor device and semiconductor device | Takashi Ozawa, Kazuya Kojima, Futoshi Tsukada | 2016-11-08 |
| 9397061 | Semiconductor device | Takashi Ozawa | 2016-07-19 |