Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8274367 | RFID system and RFID tag | Tomohiko Maeda, Kazuo Sato, Hidehiko Fuchida, Shuko Saito | 2012-09-25 |
| 7661598 | Mechanism for attaching RFID tag, transfer device and transfer system using RFID tag | Tomohiko Maeda, Kazuo Sato, Hidehiko Fuchida, Shuko Saito | 2010-02-16 |
| 7101205 | Electronic apparatus | Kiyoyuki Hatanaka, Satoshi Watanabe, Shigeo Iriguchi, Nobuo Taketomi | 2006-09-05 |
| 6786385 | Semiconductor device with gold bumps, and method and apparatus of producing the same | Masayuki Kitajima, Masakazu Takesue | 2004-09-07 |
| 6495441 | Semiconductor device with gold bumps, and method and apparatus of producing the same | Masayuki Kitajima, Masakazu Takesue | 2002-12-17 |
| 6444923 | Method of connecting printed wiring boards with each other, and printed circuit board | Shigeo Iriguchi, Satoshi Watanabe | 2002-09-03 |
| 6432806 | Method of forming bumps and template used for forming bumps | Masayuki Kitajima, Yutaka Noda | 2002-08-13 |
| 6344690 | Semiconductor device with gold bumps, and method and apparatus of producing the same | Masayuki Kitajima, Masakazu Takesue | 2002-02-05 |
| 6333554 | Semiconductor device with gold bumps, and method and apparatus of producing the same | Masayuki Kitajima, Masakazu Takesue | 2001-12-25 |
| 6320158 | Method and apparatus of fabricating perforated plate | Masayuki Kitajima, Yutaka Noda, Fumihiko Tokura | 2001-11-20 |
| 6107181 | Method of forming bumps and template used for forming bumps | Masayuki Kitajima, Yutaka Noda | 2000-08-22 |