Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7963434 | Micro component removing method | Keiichi Yamamoto, Masanao Fujii, Toru Okada | 2011-06-21 |
| 7753251 | Micro component removing apparatus | Keiichi Yamamoto, Masanao Fujii, Toru Okada | 2010-07-13 |
| 7491893 | Mounting substrate and mounting method of electronic part | — | 2009-02-17 |
| 6984254 | Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy | Yasuo Moriya, Yoshinori Nemoto, Yumiko Fukushima | 2006-01-10 |
| 6893512 | Solder alloy and soldered bond | Masayuki Kitajima, Tadaaki Shono, Yutaka Noda | 2005-05-17 |
| 6786385 | Semiconductor device with gold bumps, and method and apparatus of producing the same | Masayuki Kitajima, Yoshitaka Muraoka | 2004-09-07 |
| 6744183 | Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method | Masayuki Kitajima, Yutaka Noda, Seiichi Shimoura, Toru Okada, Masanao Fujii +4 more | 2004-06-01 |
| 6596094 | Solder paste and electronic device | Masayuki Ochiai, Yasuo Yamagishi, Hiroki Uchida, Masayuki Kitajima, Tadaaki Shono | 2003-07-22 |
| 6541898 | Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method | Masayuki Kitajima, Yutaka Noda, Seiichi Shimoura, Toru Okada, Masanao Fujii +4 more | 2003-04-01 |
| 6521176 | Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy | Masayuki Kitajima, Yasuo Moriya, Yoshinori Nemoto, Yumiko Fukushima | 2003-02-18 |
| 6495441 | Semiconductor device with gold bumps, and method and apparatus of producing the same | Masayuki Kitajima, Yoshitaka Muraoka | 2002-12-17 |
| 6467141 | Method of assembling micro-actuator | Toru Okada, Kenji Iketaki, Hidehiko Kobayashi, Yutaka Noda, Masayuki Kitajima +4 more | 2002-10-22 |
| 6428911 | Soldering method and soldered joint | Masayuki Kitajima, Tadaaki Shono, Motoko Fujioka | 2002-08-06 |
| 6361626 | Solder alloy and soldered bond | Masayuki Kitajima, Hitoshi Homma, Tadaaki Shono, Yutaka Noda | 2002-03-26 |
| 6344690 | Semiconductor device with gold bumps, and method and apparatus of producing the same | Masayuki Kitajima, Yoshitaka Muraoka | 2002-02-05 |
| 6333554 | Semiconductor device with gold bumps, and method and apparatus of producing the same | Masayuki Kitajima, Yoshitaka Muraoka | 2001-12-25 |
| 6184475 | Lead-free solder composition with Bi, In and Sn | Masayuki Kitajima, Yasuo Moriya, Yoshinori Nemoto, Yumiko Fukushima | 2001-02-06 |