Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11293876 | Fluid measurement method, fluid measurement device, and measurement system | Akihiko Azetsu, Ikkei Kitajima, Kazaki Kuratsuji | 2022-04-05 |
| 7604152 | Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same | Hiroki Uchida, Toshiya Akamatsu | 2009-10-20 |
| 6867378 | Solder paste and terminal-to-terminal connection structure | Hiroki Uchida | 2005-03-15 |
| 6712513 | Fluid bearing device | Katsuhiko Tanaka, Ikunori Sakatani, Yukio Higuchi, Takenobu Otsubo | 2004-03-30 |
| 6689639 | Method of making semiconductor device | Seiki Sakuyama, Ichiro Yamaguchi, Joji Fujimori | 2004-02-10 |
| 6596094 | Solder paste and electronic device | Yasuo Yamagishi, Hiroki Uchida, Masayuki Kitajima, Masakazu Takesue, Tadaaki Shono | 2003-07-22 |
| 6528346 | Bump-forming method using two plates and electronic device | Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe, Koki Otake +4 more | 2003-03-04 |
| 6319810 | Method for forming solder bumps | Yasuo Yamagishi, Ichiro Yamaguchi, Masahiro Yoshikawa, Koki Otake, Masataka Mizukoshi +1 more | 2001-11-20 |
| 6140286 | Defluxing agent cleaning method and cleaning apparatus | Keiji Watanabe, Yasuo Yamagishi, Ei Yano, Nobuo Igusa, Isamu Takachi | 2000-10-31 |
| 6050479 | Defluxing agent cleaning method and cleaning apparatus | Keiji Watanabe, Yasuo Yamagishi, Ei Yano, Nobuo Igusa, Isamu Takachi | 2000-04-18 |
| 6025258 | Method for fabricating solder bumps by forming solder balls with a solder ball forming member | Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe, Koki Otake +4 more | 2000-02-15 |
| 5959346 | Method for fabricating metal bumps onto electronic device | — | 1999-09-28 |
| 5695571 | Cleaning method using a defluxing agent | Keiji Watanabe, Yasuo Yamagishi, Ei Yano, Nobuo Igusa, Isamu Takachi | 1997-12-09 |
| 5643831 | Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device | Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe, Koki Otake +6 more | 1997-07-01 |
| 5616164 | Methods for making metal particle spherical and removing oxide film solder paste and soldering method | Kaoru Hashimoto, Toshimi Kawahara, Mayumi Osumi | 1997-04-01 |
| 5284796 | Process for flip chip connecting a semiconductor chip | Teru Nakanishi, Kazuaki Karasawa, Kaoru Hashimoto | 1994-02-08 |
| 4759490 | Method for soldering electronic components onto a printed wiring board using a solder paste | — | 1988-07-26 |