HU

Hidefumi Ueda

Fujitsu Limited: 5 patents #6,029 of 24,456Top 25%
YE Yaskawa Electric: 3 patents #252 of 1,006Top 30%
AC Ashimori Industry Co.: 1 patents #73 of 185Top 40%
Overall (All Time): #587,185 of 4,157,543Top 15%
9
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6656291 Solder paste and soldering method of the same 2003-12-02
6528346 Bump-forming method using two plates and electronic device Masayuki Ochiai, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe, Koki Otake +4 more 2003-03-04
6353545 Inverter apparatus with active current limiting and smoothing circuit 2002-03-05
6157181 Step-down DC/DC converter for converting a high DC input voltage into a low DC output voltage 2000-12-05
6147524 Inverter device driving method Masaichi Kudo 2000-11-14
6025258 Method for fabricating solder bumps by forming solder balls with a solder ball forming member Masayuki Ochiai, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe, Koki Otake +4 more 2000-02-15
5643831 Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device Masayuki Ochiai, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe, Koki Otake +6 more 1997-07-01
5531185 Manufacturing apparatus for use in a micro-gravity environment Koji Asano, Atsushi Shiraishi 1996-07-02
4725014 Automatic locking retractor for a seat belt assembly 1988-02-16