Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6528346 | Bump-forming method using two plates and electronic device | Masayuki Ochiai, Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Koki Otake +4 more | 2003-03-04 |
| 6433418 | Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism | Tetsuya Fujisawa, Mitsutaka Sato, Seiichi Orimo, Masaaki Seki, Masaki Waki +4 more | 2002-08-13 |
| 6094356 | Semiconductor device and semiconductor device module | Tetsuya Fujisawa, Mitsutaka Sato, Katsuhiro Hayashida, Masaaki Seki, Seiichi Orimo +1 more | 2000-07-25 |
| 6025258 | Method for fabricating solder bumps by forming solder balls with a solder ball forming member | Masayuki Ochiai, Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Koki Otake +4 more | 2000-02-15 |
| 6022759 | Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit | Masaaki Seki, Michio Sono, Ichiro Yamaguchi, Lim Cheang Hai, Koki Otake +5 more | 2000-02-08 |
| 5984699 | Method of fabricating a semiconductor device | Masaki Waki, Katsuhiro Hayashida, Mitsutaka Sato, Tadashi Uno, Tetsuya Fujisawa | 1999-11-16 |
| 5747874 | Semiconductor device, base member for semiconductor device and semiconductor device unit | Masaaki Seki, Michio Sono, Ichiro Yamaguchi, Lim Cheang Hai, Koki Otake +5 more | 1998-05-05 |
| 5643831 | Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device | Masayuki Ochiai, Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Koki Otake +6 more | 1997-07-01 |
| 5305179 | Surface-mounting type semiconductor package having an improved efficiency for heat dissipation | Michio Sono, Junichi Kasai, Kouji Saito, Masanori Yoshimoto | 1994-04-19 |