MW

Masaki Waki

Fujitsu Limited: 12 patents #2,592 of 24,456Top 15%
NT NTT: 3 patents #1,627 of 4,871Top 35%
KL Kyushu Fujitsu Electronics Limited: 2 patents #26 of 75Top 35%
📍 Kagoshima, JP: #18 of 469 inventorsTop 4%
Overall (All Time): #311,455 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
12124777 Equipment state detection device, equipment state detection method, and program Hitoshi Niigaki, Hiroaki TANIOKA, Ryoichi Kaneko, Gen Kobayashi, Kazuya Ando 2024-10-22
12117373 Testing apparatus of utility pole Ryoichi Kaneko, Hiroaki TANIOKA 2024-10-15
11922650 Point cloud analysis device, estimation device, point cloud analysis method, and program Hitoshi Niigaki, Masaaki Inoue, Yasuhiro YAO, Tomoya Shimizu, Hiroyuki OSHIDA +3 more 2024-03-05
6716675 Semiconductor device, method of manufacturing semiconductor device, lead frame, method of manufacturing lead frame, and method of manufacturing semiconductor device with lead frame Fumitoshi Fujisaki, Masao Takehiro, Shinichiro Maki 2004-04-06
6433418 Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism Tetsuya Fujisawa, Mitsutaka Sato, Seiichi Orimo, Kazuhiko Mitobe, Masaaki Seki +4 more 2002-08-13
6255740 Semiconductor device having a lead portion with outer connecting terminals Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Ryuji Nomoto, Eiji Watanabe +2 more 2001-07-03
6080604 Semiconductor device having tab-leads and a fabrication method thereof 2000-06-27
6060768 Semiconductor device, method of manufacturing the semiconductor device, and method of manufacturing lead frame Katsuhiro Hayashida, Mitsutaka Sato, Tadashi Uno, Tetsuya Fujisawa 2000-05-09
5984699 Method of fabricating a semiconductor device Katsuhiro Hayashida, Mitsutaka Sato, Tadashi Uno, Kazuhiko Mitobe, Tetsuya Fujisawa 1999-11-16
5701028 Semiconductor device having tab leads 1997-12-23
5656550 Method of producing a semicondutor device having a lead portion with outer connecting terminal Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Ryuji Nomoto, Eiji Watanabe +2 more 1997-08-12
5530292 Semiconductor device having a plurality of chips Junichi Kasai, Tsuyoshi Aoki, Toshiyuki Honda, Hirotaka Sato 1996-06-25
5479051 Semiconductor device having a plurality of semiconductor chips Tosiyuki Honda, Yukio Gomi 1995-12-26
5463253 Semiconductor device having a plurality of chips Junichi Kasai, Tsuyoshi Aoki, Toshiyuki Honda, Hirotaka Sato 1995-10-31
5447888 Process of ejecting an encapsulated semiconductor device from a mold by directly contacting exterior leads with ejector pins Akira Takashima, Toshiyuki Honda 1995-09-05