Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5724233 | Semiconductor device having first and second semiconductor chips with a gap therebetween, a die stage in the gap and associated lead frames disposed in a package, the lead frames providing electrical connections from the chips to an exterior of the packag | Takao Haranosono | 1998-03-03 |
| 5579208 | Semiconductor device having a plurality of semiconductor chips | Takao Haranosono | 1996-11-26 |
| 5479051 | Semiconductor device having a plurality of semiconductor chips | Masaki Waki, Yukio Gomi | 1995-12-26 |
| 5471369 | Semiconductor device having a plurality of semiconductor chips | Takao Haranosono | 1995-11-28 |
| 5361970 | Method of producing a semiconductor integrated circuit device having terminal members provided between semiconductor element and leads | Junichi Kasai, Michio Sono | 1994-11-08 |
| 5309016 | Semiconductor integrated circuit device having terminal members provided between semiconductor element and leads | Junichi Kasai, Michio Sono | 1994-05-03 |