Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5724233 | Semiconductor device having first and second semiconductor chips with a gap therebetween, a die stage in the gap and associated lead frames disposed in a package, the lead frames providing electrical connections from the chips to an exterior of the packag | Tosiyuki Honda | 1998-03-03 |
| 5579208 | Semiconductor device having a plurality of semiconductor chips | Tosiyuki Honda | 1996-11-26 |
| 5471369 | Semiconductor device having a plurality of semiconductor chips | Tosiyuki Honda | 1995-11-28 |