Issued Patents All Time
Showing 1–25 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8378489 | Semiconductor device and manufacturing method therefor | Shiro Ozaki, Yoshihiro Nakata, Yasushi Kobayashi | 2013-02-19 |
| 8349542 | Manufacturing process of semiconductor device | Miwa Kozawa, Koji Nozaki, Takahisa Namiki, Junichi Kon | 2013-01-08 |
| 8334091 | Resist pattern swelling material, and method for patterning using same | Koji Nozaki, Miwa Kozawa, Takahisa Namiki, Junichi Kon | 2012-12-18 |
| 8207059 | Silicon compound, ultraviolet absorbent, method for manufacturing multilayer wiring device and multilayer wiring device | Shirou Ozaki, Yoshihiro Nakata | 2012-06-26 |
| 8124239 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | Yoshihiro Nakata | 2012-02-28 |
| 8062414 | Coating liquid for forming amorphous silica-based coating film with low dielectric constant | Akira Nakashima, Miki Egami, Michio Komatsu, Yoshihiro Nakata, Katsumi Suzuki | 2011-11-22 |
| 8057986 | Method for forming resist pattern and method for manufacturing a semiconductor device | Junichi Kon | 2011-11-15 |
| 7985700 | Composition for forming insulating film and method for fabricating semiconductor device | Shirou Ozaki, Yoshihiro Nakata | 2011-07-26 |
| 7928536 | Roughness reducing film at interface, materials for forming roughness reducing film at interface, wiring layer and semiconductor device using the same, and method for manufacturing semiconductor device | Tadahiro Imada, Yoshihiro Nakata | 2011-04-19 |
| 7830013 | Material for forming adhesion reinforcing layer, adhesion reinforcing layer, semiconductor device, and manufacturing method thereof | Junichi Kon, Yoshihiro Nakata, Tadahiro Imada | 2010-11-09 |
| 7744768 | Resist pattern thickening material, resist pattern and forming process thereof, and semiconductor device and manufacturing process thereof | Miwa Kozawa, Koji Nozaki, Takahisa Namiki, Junichi Kon | 2010-06-29 |
| 7723016 | Method for forming resist pattern and method for manufacturing a semiconductor device | Junichi Kon | 2010-05-25 |
| 7659357 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | Yoshihiro Nakata | 2010-02-09 |
| 7655576 | Insulator film, manufacturing method of multilayer wiring device and multilayer wiring device | Shirou Ozaki, Yoshihiro Nakata | 2010-02-02 |
| 7488569 | Negative resist composition, a method for forming a resist pattern thereof, and a method for fabricating a semiconductor device | Miwa Kozawa, Koji Nozaki, Keiji Watanabe | 2009-02-10 |
| 7476970 | Composition for forming insulating film and method for fabricating semiconductor device | Shirou Ozaki, Yoshihiro Nakata | 2009-01-13 |
| 7465527 | Resist material, resist pattern and forming method for the same, and a semiconductor device and manufacturing method for the same | Junichi Kon | 2008-12-16 |
| 7403024 | Contactor having contact electrodes of metal springs embedded in a plate-like structure | Shigeyuki Maruyama, Kazuhiro Tashiro, Naoyuki Watanabe, Daisuke Koizumi, Takafumi Hashitani | 2008-07-22 |
| 7358299 | Silicon-based composition, low dielectric constant film, semiconductor device, and method for producing low dielectric constant film | Yoshihiro Nakata | 2008-04-15 |
| 7262142 | Semiconductor device fabrication method | Yoshihiro Nakata, Shirou Ozaki | 2007-08-28 |
| 7235866 | Low dielectric constant film material, film and semiconductor device using such material | Yoshihiro Nakata, Shun-ichi Fukuyama, Katsumi Suzuki, Tamotsu Owada, Iwao Sugiura | 2007-06-26 |
| 7232769 | Method of forming amorphous silica-based coating film with low dielectric constant and thus obtained silica-based coating film | Akira Nakashima, Miki Egami, Michio Komatsu, Yoshihiro Nakata, Katsumi Suzuki | 2007-06-19 |
| 7202679 | Contactor having conductive particles in a hole as a contact electrode | Shigeyuki Maruyama, Susumu Kida, Naoyuki Watanabe, Takafumi Hashitani, Ichiro Midorikawa | 2007-04-10 |
| 7189783 | Resist pattern thickening material, resist pattern and forming process thereof, and semiconductor device and manufacturing process thereof | Miwa Kozawa, Koji Nozaki, Takahisa Namiki, Junichi Kon | 2007-03-13 |
| 7170177 | Semiconductor apparatus | Yoshihiro Nakata, Katsumi Suzuki, Iwao Sugiura | 2007-01-30 |