Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11714057 | Method of manufacturing gas sensor device | Satoru Momose, Michio Ushigome, Osamu Tsuboi | 2023-08-01 |
| 11073492 | Sensor device, method for producing same, and gas sensor | Michio Ushigome, Osamu Tsuboi | 2021-07-27 |
| 10495595 | Gas sensor device, gas measurement method, and gas measurement device | Michio Ushigome, Satoru Momose, Ryozo Takasu, Osamu Tsuboi | 2019-12-03 |
| 10481146 | Gas sensor and information processing system | Satoru Momose, Osamu Tsuboi | 2019-11-19 |
| 10371658 | Gas sensor and sensor apparatus | Satoru Momose, Osamu Tsuboi | 2019-08-06 |
| 9820412 | Modular data center | Masatoshi OGAWA, Hiroshi Endo, Takahiro Arioka, Shigeyoshi Umemiya, Yoshio Kikuchi +5 more | 2017-11-14 |
| 7339277 | Semiconductor device having passive component and support substrate with electrodes and through electrodes passing through support substrate | Takeshi Shioga, Kazuaki Kurihara | 2008-03-04 |
| 6873038 | Capacitor and semiconductor device and method for fabricating the semiconductor device | Takeshi Shioga, Kazuaki Kurihara | 2005-03-29 |
| 6764938 | Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof | Toshiya Akamatsu, Teru Nakanishi, Kozo Shimizu | 2004-07-20 |
| 6624501 | Capacitor and semiconductor device | Takeshi Shioga, Kazuaki Kurihara | 2003-09-23 |
| 6608381 | Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof | Toshiya Akamatsu, Teru Nakanishi, Kozo Shimizu | 2003-08-19 |
| 6136047 | Solder bump transfer plate | Teru Nakanishi, Toshiya Akamatsu | 2000-10-24 |
| 6121062 | Process of fabricating semiconductor unit employing bumps to bond two components | Teru Nakanishi, Kaoru Hashimoto, Toshihiro Sakamura | 2000-09-19 |
| 6008071 | Method of forming solder bumps onto an integrated circuit device | Teru Nakanishi, Toshiya Akamatsu | 1999-12-28 |
| 5977637 | Integrated electronic device having flip-chip connection with circuit board | Toshiya Akamatsu, Teru Nakanishi, Kozo Shimizu | 1999-11-02 |
| 5877079 | Method for manufacturing a semiconductor device and a method for mounting a semiconductor device for eliminating a void | Yasuhiro Takaki | 1999-03-02 |
| 5611481 | Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof | Toshiya Akamatsu, Teru Nakanishi, Kozo Shimizu | 1997-03-18 |
| 5284796 | Process for flip chip connecting a semiconductor chip | Teru Nakanishi, Masayuki Ochiai, Kaoru Hashimoto | 1994-02-08 |