Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6361626 | Solder alloy and soldered bond | Hitoshi Homma, Masakazu Takesue, Tadaaki Shono, Yutaka Noda | 2002-03-26 |
| 6344690 | Semiconductor device with gold bumps, and method and apparatus of producing the same | Masakazu Takesue, Yoshitaka Muraoka | 2002-02-05 |
| 6333554 | Semiconductor device with gold bumps, and method and apparatus of producing the same | Masakazu Takesue, Yoshitaka Muraoka | 2001-12-25 |
| 6320158 | Method and apparatus of fabricating perforated plate | Yutaka Noda, Yoshitaka Muraoka, Fumihiko Tokura | 2001-11-20 |
| 6184475 | Lead-free solder composition with Bi, In and Sn | Masakazu Takesue, Yasuo Moriya, Yoshinori Nemoto, Yumiko Fukushima | 2001-02-06 |
| 6107181 | Method of forming bumps and template used for forming bumps | Yutaka Noda, Yoshitaka Muraoka | 2000-08-22 |