Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10996403 | Optical fiber mounting method and optical module | Takayoshi Matsumura | 2021-05-04 |
| 10629556 | Composite bump, method for forming composite bump, and substrate | Takashi Kubota, Takayoshi Matsumura | 2020-04-21 |
| 10591690 | Optical module and method of manufacturing the same | Akio Sugama, Takayoshi Matsumura | 2020-03-17 |
| 10586770 | Optical module | Takayoshi Matsumura, Norio Kainuma, Takashi Kubota, Kenji Fukuzono, Takumi Masuyama +2 more | 2020-03-10 |
| 10444450 | Optical module | Takayoshi Matsumura, Kenji Fukuzono, Norio Kainuma, Takashi Kubota, Takumi Masuyama +2 more | 2019-10-15 |
| 10443957 | Cooling plate and information processing device | Shunichi Kikuchi, Yoshihisa Iwakiri, Takayoshi Matsumura | 2019-10-15 |
| 10261249 | Optical module and method of manufacturing optical module | Norio Kainuma, Kenji Fukuzono | 2019-04-16 |
| 10115694 | Electronic device, electronic device fabrication method, and electronic apparatus | Hidehiko Kira, Sanae Iijima | 2018-10-30 |
| 10103510 | Optical module and method of manufacturing optical module | Norio Kainuma | 2018-10-16 |
| 9817453 | Cooling device and electronic apparatus | — | 2017-11-14 |
| 9704775 | Method for manufacturing thermal interface sheet | — | 2017-07-11 |
| 9642287 | Cooling plate and data processing system provided with cooling plates | Shunichi Kikuchi, Yoshihisa Iwakiri, Hiroshi Onuki | 2017-05-02 |
| 9230964 | Stacked three dimensional semiconductor device with in-circuit antenna | Makoto Suwada | 2016-01-05 |
| 9117788 | Heat sink device and method of repairing semiconductor device | Tsuyoshi Yamamoto, Rie Takada, Kenichiro Tsubone, Yasuhide Kuroda, Harumi Yagi | 2015-08-25 |
| 7880485 | High-sensitive resistance measuring device and monitoring method of solder bump | — | 2011-02-01 |
| 6971571 | Reflow soldering apparatus and reflow soldering method | Osamu Higashi | 2005-12-06 |
| 6396701 | Semiconductor unit and cooling device | Yasuo Kawamura | 2002-05-28 |