Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9117788 | Heat sink device and method of repairing semiconductor device | Tsuyoshi Yamamoto, Naoaki Nakamura, Rie Takada, Kenichiro Tsubone, Yasuhide Kuroda | 2015-08-25 |
| 6109507 | Method of forming solder bumps and method of forming preformed solder bumps | Noritsugu Ozaki, Tsuyoshi Yamamoto, Toshiyuki Nakada, Takeshi Komiyama, Yoshihito Okuwaki | 2000-08-29 |
| 4691855 | Twin wire splitter system | — | 1987-09-08 |