Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811659 | Separator for electricity storage device, laminate and porous film | Hiroshi Miyazawa, Keitaro Ameyama | 2020-10-20 |
| 10522483 | Package assembly for embedded die and associated techniques and configurations | — | 2019-12-31 |
| 10304785 | Package assembly for embedded die and associated techniques and configurations | — | 2019-05-28 |
| 10153473 | Separator for electricity storage device, laminate and porous film | Hiroshi Miyazawa, Keitaro Ameyama | 2018-12-11 |
| 10014263 | Package assembly for embedded die and associated techniques and configurations | — | 2018-07-03 |
| 9887110 | Substrate warpage control using temper glass with uni-directional heating | Chee-Key Chung | 2018-02-06 |
| 9685414 | Package assembly for embedded die and associated techniques and configurations | — | 2017-06-20 |
| 7935891 | Wiring board manufacturing method | Kenji Takano, Kenji Iida, Kenichiro Abe, Keiji Arai, Kiyotaka Seyama | 2011-05-03 |
| 7377030 | Wiring board manufacturing method | Kenji Takano, Kenji IlDA, Kenichiro Abe, Keiji Arai, Kiyotaka Seyama | 2008-05-27 |
| 7152314 | Method of manufacturing circuit board | Takefumi Kashiwa, Kenji Takano, Kenji Iida, Kenichiro Abe | 2006-12-26 |
| 7002080 | Multilayer wiring board | Motoaki Tani, Nobuyuki Hayashi, Tomoyuki Abe, Yasuhito Takahashi | 2006-02-21 |