Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9318426 | Semiconductor device and method of manufacturing the same | Shinya Iijima, Shinichi Sugiura, Hiromichi Watanabe | 2016-04-19 |
| 9312151 | Method of manufacturing semiconductor device and method of manufacturing electronic device including an adhesive layer on a support member | Shinya Sasaki, Yoshikatsu Ishizuki | 2016-04-12 |
| 9214361 | Semiconductor device manufacturing method and electronic device manufacturing method | Yoshikatsu Ishizuki, Shinya Sasaki | 2015-12-15 |
| 9177938 | Method for manufacturing semiconductor apparatus | Keishiro Okamoto | 2015-11-03 |
| 9136172 | Method of manufacturing semiconductor device and method of manufacturing electronic assembly | Yoshikatsu Ishizuki, Shinya Sasaki | 2015-09-15 |
| 8866312 | Semiconductor apparatus, method for manufacturing the same and electric device | Keishiro Okamoto | 2014-10-21 |
| 8420444 | Semiconductor device and method of manufacturing the same | Shinya Iijima, Shinichi Sugiura, Hiromichi Watanabe | 2013-04-16 |
| 8318599 | Resin layer formation method and semiconductor device fabrication method | Kanae Nakagawa | 2012-11-27 |
| 7799604 | Semiconductor device having multilayer printed wiring board and manufacturing method of the same | Tomoyuki Abe | 2010-09-21 |
| 7640660 | Method for manufacturing multilayer wiring board incorporating carbon fibers and glass fibers | Tomoyuki Abe, Nobuyuki Hayashi | 2010-01-05 |
| 7420130 | Wiring board and method for fabricating the same | Keishiro Okamoto, Tomoyuki Abe, Nobuyuki Hayashi | 2008-09-02 |
| 7400035 | Semiconductor device having multilayer printed wiring board | Tomoyuki Abe | 2008-07-15 |
| 7388157 | Printed wiring board | Tomoyuki Abe, Nobuyuki Hayashi, Kenichiro Abe, Kenji Iida | 2008-06-17 |
| 7246435 | Wiring board and method for fabricating the same | Keishiro Okamoto, Tomoyuki Abe, Nobuyuki Hayashi | 2007-07-24 |
| 7224046 | Multilayer wiring board incorporating carbon fibers and glass fibers | Tomoyuki Abe, Nobuyuki Hayashi | 2007-05-29 |
| 7017265 | Method for manufacturing multilayer wiring board, and multilayer wiring board manufactured thereby | Nobuyuki Hayashi, Tomoyuki Abe | 2006-03-28 |
| 7002080 | Multilayer wiring board | Nobuyuki Hayashi, Tomoyuki Abe, Yasuhito Takahashi, Takashi Shuto | 2006-02-21 |
| 6869665 | Wiring board with core layer containing inorganic filler | Nobuyuki Hayashi, Tomoyuki Abe, Yasuhito Takahashi, Yoshiyasu Saeki | 2005-03-22 |
| 6846549 | Multilayer printed wiring board | Nobuyuki Hayashi, Hiroyuki Machida, Takeshi Ishitsuka, Yasuo Yamagishi | 2005-01-25 |
| 6261741 | Photosensitive heat-resistant resin composition, method of patterning insulating film made of the same, and patterned insulating film obtained thereby | Nobuyuki Hayashi, Hiroyuki Machida | 2001-07-17 |
| 6045975 | Photosensitive, heat-resistant resin composition for forming patterns | Eiji Horikoshi, Isao Watanabe, Shoichi Miyahara, Takashi Ito, Makoto Sasaki | 2000-04-04 |
| 6013419 | Process for using photosensitive, heat-resistant resin composition to form patterns | Eiji Horikoshi, Isao Watanabe, Shoichi Miyahara, Takashi Ito, Makoto Sasaki | 2000-01-11 |
| 5972562 | Visible radiation-curable solder resist compositions, and method for forming solder resist patterns | Hiroyuki Machida, Nobuyuki Hayashi | 1999-10-26 |
| 5362359 | Circuit board and process for producing same | Eiji Horikoshi, Isao Watanabe, Katsuhide Natori, Takehiko Sato | 1994-11-08 |
| 5308929 | Via hole structure and process for formation thereof | Shoichi Miyahara, Makoto Sasaki, Eiji Horikoshi, Isao Kawamura | 1994-05-03 |