Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11709718 | Barrier synchronization circuit, barrier synchronization method, and parallel information processing apparatus | Masaki Arai, Yasumoto Tomita | 2023-07-25 |
| 11487593 | Barrier synchronization system and parallel information processing apparatus | Masaki Arai, Yasumoto Tomita | 2022-11-01 |
| 10777726 | Thermoelectric conversion module, sensor module, and information processing system | Takashi Suzuki | 2020-09-15 |
| 10537044 | Heat dissipating component, manufacturing method for heat dissipating component, electronic device, manufacturing method for electronic device, integrated module, and information processing system | Takashi Suzuki | 2020-01-14 |
| 8962470 | Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus | Masataka Mizukoshi, Yoshikatsu Ishizuki, Keishiro Okamoto, Kazuo Teshirogi, Taiji Sakai | 2015-02-24 |
| 8479386 | Method for manufacturing interposer | Takeshi Shioga, Kazuaki Kurihara, Taiji Sakai, Masataka Mizukoshi | 2013-07-09 |
| 8318599 | Resin layer formation method and semiconductor device fabrication method | Motoaki Tani | 2012-11-27 |
| 8058110 | Plating method, semiconductor device fabrication method and circuit board fabrication method | Masataka Mizukoshi, Takeshi Shioga, Kazuaki Kurihara, John David Baniecki | 2011-11-15 |
| 7927998 | Plating method, semiconductor device fabrication method and circuit board fabrication method | Masataka Mizukoshi, Takeshi Shioga, Kazuaki Kurihara, John David Baniecki | 2011-04-19 |
| 7863524 | Interposer and method for manufacturing the same | Takeshi Shioga, Kazuaki Kurihara, Taiji Sakai, Masataka Mizukoshi | 2011-01-04 |
| 7704856 | Semiconductor device, wiring substrate forming method, and substrate processing apparatus | Masataka Mizukoshi, Kazuo Teshirogi | 2010-04-27 |
| 7670940 | Plating method, semiconductor device fabrication method and circuit board fabrication method | Masataka Mizukoshi, Takeshi Shioga, Kazuaki Kurihara, John David Baniecki | 2010-03-02 |
| 7648907 | Semiconductor device, wiring substrate forming method, and substrate processing apparatus | Masataka Mizukoshi, Kazuo Teshirogi | 2010-01-19 |
| 7614142 | Method for fabricating an interposer | Takeshi Shioga, Yoshikatsu Ishizuki, Taiji Sakai, Masataka Mizukoshi, John David Baniecki +1 more | 2009-11-10 |
| 7485962 | Semiconductor device, wiring substrate forming method, and substrate processing apparatus | Masataka Mizukoshi, Kazuo Teshirogi | 2009-02-03 |
| 7355290 | Interposer and method for fabricating the same | Takeshi Shioga, Yoshikatsu Ishizuki, Taiji Sakai, Masataka Mizukoshi, John David Baniecki +1 more | 2008-04-08 |
| 7247524 | Manufacturing method of wiring substrate | — | 2007-07-24 |
| 7081304 | Surface conductive resin, process for forming the same and wiring board | — | 2006-07-25 |
| 6893681 | Surface conductive resin, a coaxial cable, a wiring board, and process for manufacturing the same | Nawalage Cooray, Masataka Mizukoshi | 2005-05-17 |