Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9010615 | Bonding apparatus and bonding method | Kazuhiro Yoshimoto, Yuzo Shimobeppu, Yoshiaki Shinjo | 2015-04-21 |
| 8962470 | Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus | Masataka Mizukoshi, Yoshikatsu Ishizuki, Kanae Nakagawa, Keishiro Okamoto, Taiji Sakai | 2015-02-24 |
| 8444799 | Method for manufacturing semiconductor device and surface protective tape | Hironori Fukaya, Yuzo Shimobeppu, Kazuhiro Yoshimoto, Kazuyuki Uragou, Mika Sakamoto +1 more | 2013-05-21 |
| 8440545 | Method of manufacturing semiconductor device with spraying fluid | Hironori Fukaya, Yuzo Shimobeppu, Kazuhiro Yoshimoto, Yoshiaki Shinjo, Mika Sakamoto | 2013-05-14 |
| 8016973 | Film bonding method, film bonding apparatus, and semiconductor device manufacturing method | Yoshiaki Shinjo, Yuzo Shimobeppu, Kazuhiro Yoshimoto | 2011-09-13 |
| 7857140 | Semiconductor wafer storage case and semiconductor wafer storing method | Yoshiaki Shinjo, Yuzo Shimobeppu, Kazuhiro Yoshimoto | 2010-12-28 |
| 7820487 | Manufacturing method of semiconductor device | Yuzo Shimobeppu, Kazuhiro Yoshimoto, Yoshiaki Shinjo | 2010-10-26 |
| 7704856 | Semiconductor device, wiring substrate forming method, and substrate processing apparatus | Kanae Nakagawa, Masataka Mizukoshi | 2010-04-27 |
| 7655505 | Manufacturing method of semiconductor device | Yuzo Shimobeppu, Kazuhiro Yoshimoto, Yoshiaki Shinjo | 2010-02-02 |
| 7648907 | Semiconductor device, wiring substrate forming method, and substrate processing apparatus | Kanae Nakagawa, Masataka Mizukoshi | 2010-01-19 |
| 7571538 | Vacuum fixing jig for semiconductor device | Yuzo Shimobeppu, Kazuhiro Yoshimoto, Mitsuhisa Watanabe, Yoshiaki Shinjo, Eiji Yoshida +1 more | 2009-08-11 |
| 7563343 | Film lamination apparatus and method and a manufacturing method of a semiconductor apparatus | Yuzo Shimobeppu, Yoshiaki Shinjo | 2009-07-21 |
| 7485962 | Semiconductor device, wiring substrate forming method, and substrate processing apparatus | Kanae Nakagawa, Masataka Mizukoshi | 2009-02-03 |
| 7479627 | Semiconductor device having transparent member and manufacturing method of the same | Kazuhiro Yoshimoto, Yuzo Shimobeppu, Yoshiaki Shinjo | 2009-01-20 |
| 7432114 | Semiconductor device manufacturing method | Yuzo Shimobeppu, Kazuhiro Yoshimoto, Yoshiaki Shinjo, Masataka Mizukoshi | 2008-10-07 |
| 7395847 | Jig for a semiconductor substrate | Yuzo Shimobeppu, Kazuhiro Yoshimoto, Mitsuhisa Watanabe, Yoshiaki Shinjo, Eiji Yoshida +1 more | 2008-07-08 |
| 7109561 | Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig | Yuzo Shimobeppu, Kazuhiro Yoshimoto, Mitsuhisa Watanabe, Yoshiaki Shinjo, Eiji Yoshida +1 more | 2006-09-19 |
| 6951800 | Method of making semiconductor device that has improved structural strength | Yoshiaki Shinjo, Yuzo Shimobeppu, Kazuhiro Yoshimoto, Eiji Yoshida, Noboru Hayasaka +1 more | 2005-10-04 |
| 6902944 | Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig | Yuzo Shimobeppu, Kazuhiro Yoshimoto, Mitsuhisa Watanabe, Yoshiaki Shinjo, Eiji Yoshida +1 more | 2005-06-07 |
| 6824643 | Method and device of peeling semiconductor device using annular contact members | Kazuhiro Yoshimoto, Eiji Yoshida | 2004-11-30 |
| 6750074 | Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig | Yuzo Shimobeppu, Kazuhiro Yoshimoto, Mitsuhisa Watanabe, Yoshiaki Shinjo, Eiji Yoshida +1 more | 2004-06-15 |
| 6528348 | Semiconductor device having protruding electrodes higher than a sealed portion | Fumihiko Ando, Akira Takashima, Hiroshi Onodera, Eiji Yoshida | 2003-03-04 |
| 6461942 | Semiconductor chip removing and conveying method and device | Mitsuhisa Watanabe, Eiji Yoshida, Yuzo Shimobeppu, Yoshito Konno, Kyouhei Tamaki | 2002-10-08 |
| 6388333 | Semiconductor device having protruding electrodes higher than a sealed portion | Fumihiko Taniguchi, Kouhei Orikawa, Tadashi Uno, Fumihiko Ando, Akira Takashima +2 more | 2002-05-14 |