Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12259201 | Header plates structure of heat exchanger | Akira Komuro, Atsushi Okubo, Hiro Kubota | 2025-03-25 |
| 11852866 | Waveguide member and waveguide layered product | Toshiki Iwai | 2023-12-26 |
| 11740027 | Stacked plate heat exchanger | Takuya Bungo, Atsushi Okubo | 2023-08-29 |
| 11152291 | Multilayer substrate | Toshiki Iwai | 2021-10-19 |
| 11114418 | Electronic device, method of manufacturing electronic device, and electronic apparatus | Taiki Uemura, Seiki Sakuyama | 2021-09-07 |
| 11105559 | Drawn cup-type heat exchanger | Atsushi Okubo | 2021-08-31 |
| 11057996 | Circuit board, method of manufacturing circuit board, and electronic device | Toshiki Iwai, Daisuke Mizutani, Seiki Sakuyama | 2021-07-06 |
| 10976110 | Plate laminate type heat exchanger | Takuya Bungo, Atsushi Okubo | 2021-04-13 |
| 10837718 | Laminated core type heat sink | Takuya Bungo, Atsushi Okubo | 2020-11-17 |
| 10739085 | Laminated heat sink core | Takuya Bungo, Atsushi Okubo | 2020-08-11 |
| 10724807 | Heat exchanger and method for assembling same | Atsushi Okubo, Takuya Bungo | 2020-07-28 |
| 10655922 | Laminated heat sink | Takuya Bungo, Atsushi Okubo | 2020-05-19 |
| 10383229 | Electronic apparatus, fabrication method therefor and electronic part | Taiki Uemura, Hideki Kitada | 2019-08-13 |
| 10309729 | Heat exchanger core | Takuya Bungo, Atsushi Okubo, Hirotaka UEKI, Kazuo Maegawa | 2019-06-04 |
| 10283434 | Electronic device, method for manufacturing the electronic device, and electronic apparatus | Seiki Sakuyama, Nobuhiro Imaizumi, Aki Dote | 2019-05-07 |
| 10274262 | Heat exchanger | Atsushi Okubo, Takuya Bungo | 2019-04-30 |
| 10006723 | Seal structure for tank | Atsushi Okubo, Takuya Bungo | 2018-06-26 |
| 9995539 | Corrugated fins for heat exchanger | Takuya Bungo, Noriyuki Ishii, Atsushi Okubo | 2018-06-12 |
| 9911642 | Method of manufacturing an electronic device, and electronic device manufacturing apparatus | Nobuhiro Imaizumi | 2018-03-06 |
| 9402313 | Conductive material, conductive paste, circuit board, and semiconductor device | Seiki Sakuyama | 2016-07-26 |
| 8962470 | Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus | Masataka Mizukoshi, Yoshikatsu Ishizuki, Kanae Nakagawa, Keishiro Okamoto, Kazuo Teshirogi | 2015-02-24 |
| 8922027 | Electronic device having electrodes bonded with each other | Nobuhiro Imaizumi | 2014-12-30 |
| 8713792 | Method of manufacturing a printed wiring board | Seiki Sakuyama | 2014-05-06 |
| 8673050 | Conductive material, conductive paste, circuit board, and semiconductor device | Seiki Sakuyama | 2014-03-18 |
| 8479386 | Method for manufacturing interposer | Takeshi Shioga, Kazuaki Kurihara, Kanae Nakagawa, Masataka Mizukoshi | 2013-07-09 |