Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195577 | Switch element and method for manufacturing switch element | — | 2021-12-07 |
| 10597050 | Air spring and bogie | Takayuki Sawa, Yasuhiko Ura, Takehiro Nishimura, Keiichiro Kamura, Yoshi Sato | 2020-03-24 |
| 10563719 | Air spring and bogie | Takayuki Sawa, Yasuhiko Ura, Takehiro Nishimura, Keiichiro Kamura, Yoshi Sato | 2020-02-18 |
| 10538257 | Air spring and bogie | Takayuki Sawa, Yasuhiko Ura | 2020-01-21 |
| 10449979 | Air spring and bogie | Takayuki Sawa, Yasuhiko Ura, Takehiro Nishimura, Keiichiro Kamura, Yoshi Sato | 2019-10-22 |
| 10435044 | Air spring and bogie | Takayuki Sawa, Yasuhiko Ura, Takehiro Nishimura, Keiichiro Kamura, Yoshi Sato | 2019-10-08 |
| 10383229 | Electronic apparatus, fabrication method therefor and electronic part | Taiki Uemura, Taiji Sakai | 2019-08-13 |
| 10319667 | Electronic device and method of fabricating the same | Shoichi Miyahara, Aki Dote | 2019-06-11 |
| 10008436 | Semiconductor device | Aki Dote, Takeshi Ishitsuka | 2018-06-26 |
| 9202752 | Semiconductor device with first and second semiconductor substrates | — | 2015-12-01 |
| 8836122 | Semiconductor device having copper wiring with increased migration resistance | — | 2014-09-16 |
| 8540220 | Air spring for vehicle and railway truck for vehicle | Takayuki Sawa, Toshihisa Adachi, Hirokazu Haraguchi | 2013-09-24 |
| 8383509 | Manufacture method for semiconductor device having improved copper diffusion preventive function of plugs and wirings made of copper or copper alloy and semiconductor device of this kind | Yumiko Koura, Kiyoshi Ozawa | 2013-02-26 |
| 8319277 | Semiconductor device, method of manufacturing same, and apparatus for designing same | Takahiro Kimura | 2012-11-27 |
| 8071474 | Method of manufacturing semiconductor device suitable for forming wiring using damascene method | Noriyoshi Shimizu, Nobuyuki Ohtsuka, Yoshiyuki Nakao | 2011-12-06 |
| 7871924 | Semiconductor device having copper wiring | Yumiko Koura | 2011-01-18 |
| 7868456 | Semiconductor device and method for fabricating the same | Takashi Suzuki | 2011-01-11 |
| 7846833 | Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor device | Nobuyuki Ohtsuka, Noriyoshi Shimizu, Yoshiyuki Nakao | 2010-12-07 |
| 7795141 | Method of manufacturing semiconductor device suitable for forming wiring using damascene method | Noriyoshi Shimizu, Nobuyuki Ohtsuka, Yoshiyuki Nakano | 2010-09-14 |
| 7713869 | Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor device | Nobuyuki Ohtsuka, Noriyoshi Shimizu, Yoshiyuki Nakao | 2010-05-11 |
| 7670925 | Semiconductor device, method of manufacturing same, and apparatus for designing same | Takahiro Kimura | 2010-03-02 |
| 7611984 | Manufacture method for semiconductor device having improved copper diffusion preventive function of plugs and wirings made of copper or copper alloy | Yumiko Koura, Kiyoshi Ozawa | 2009-11-03 |
| 7507666 | Manufacture method for semiconductor device having concave portions filled with conductor containing Cu as its main composition | Yoshiyuki Nakao, Nobuyuki Ohtsuka, Noriyoshi Shimizu | 2009-03-24 |
| 7416985 | Semiconductor device having a multilayer interconnection structure and fabrication method thereof | Tamotsu Yamamoto, Hirofumi Watani, Hiroshi Horiuchi, Motoshu Miyajima | 2008-08-26 |
| 7413977 | Method of manufacturing semiconductor device suitable for forming wiring using damascene method | Noriyoshi Shimizu, Nobuyuki Ohtsuka, Yoshiyuki Nakao | 2008-08-19 |