Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9559058 | Semiconductor device and method for manufacturing the same | Masaki Haneda, Michie Sunayama, Noriyoshi Shimizu, Yoshiyuki Nakao, Takahiro Tabira | 2017-01-31 |
| 8889505 | Method for manufacturing semiconductor device | Shinichi Akiyama, Kazuya Okubo | 2014-11-18 |
| 8551832 | Method for manufacturing semiconductor device | Shinichi Akiyama, Kazuya Okubo | 2013-10-08 |
| 8415798 | Semiconductor device having a conductor buried in an opening | Noriyoshi Shimizu | 2013-04-09 |
| 8168532 | Method of manufacturing a multilayer interconnection structure in a semiconductor device | Masaki Haneda, Michie Sunayama, Noriyoshi Shimizu, Yoshiyuki Nakao, Takahiro Tabira | 2012-05-01 |
| 8101513 | Manufacture method for semiconductor device using damascene method | Tsuyoshi Kanki, Hisaya Sakai, Noriyoshi Shimizu | 2012-01-24 |
| 8071474 | Method of manufacturing semiconductor device suitable for forming wiring using damascene method | Noriyoshi Shimizu, Hideki Kitada, Yoshiyuki Nakao | 2011-12-06 |
| 8067836 | Semiconductor device with reduced increase in copper film resistance | Masaki Haneda, Noriyoshi Shimizu, Yoshiyuki Nakao, Michie Sunayama, Takahiro Tabira | 2011-11-29 |
| 7935624 | Fabrication method of semiconductor device having a barrier layer containing Mn | Noriyoshi Shimizu, Yoshiyuki Nakao, Hisaya Sakai | 2011-05-03 |
| 7928476 | Semiconductor device and method of manufacturing the same | Hiroshi Kudo, Masaki Haneda, Tamotsu Owada | 2011-04-19 |
| 7846833 | Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor device | Hideki Kitada, Noriyoshi Shimizu, Yoshiyuki Nakao | 2010-12-07 |
| 7795141 | Method of manufacturing semiconductor device suitable for forming wiring using damascene method | Noriyoshi Shimizu, Hideki Kitada, Yoshiyuki Nakano | 2010-09-14 |
| 7713869 | Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor device | Hideki Kitada, Noriyoshi Shimizu, Yoshiyuki Nakao | 2010-05-11 |
| 7507659 | Fabrication process of a semiconductor device | Noriyoshi Shimizu, Yoshiyuki Nakao | 2009-03-24 |
| 7507666 | Manufacture method for semiconductor device having concave portions filled with conductor containing Cu as its main composition | Yoshiyuki Nakao, Hideki Kitada, Noriyoshi Shimizu | 2009-03-24 |
| 7413977 | Method of manufacturing semiconductor device suitable for forming wiring using damascene method | Noriyoshi Shimizu, Hideki Kitada, Yoshiyuki Nakao | 2008-08-19 |
| 7279790 | Semiconductor device and a manufacturing method thereof | Hideki Kitada, Noriyoshi Shimizu, Takayuki Ohba | 2007-10-09 |
| 7199044 | Method for manufacturing semiconductor device | Akira Furuya, Shinichi Ogawa, Hiroshi Okamura | 2007-04-03 |
| 6992005 | Semiconductor device and method of manufacturing the same | Noriyoshi Shimizu, Hisaya Sakai, Yoshiyuki Nakao, Hiroki Kondo, Takashi Suzuki | 2006-01-31 |
| 6900542 | Semiconductor device having increased adhesion between a barrier layer for preventing copper diffusion and a conductive layer, and method of manufacturing the same | Hisaya Sakai, Noriyoshi Shimizu | 2005-05-31 |
| 6750541 | Semiconductor device | Noriyoshi Shimizu, Hisaya Sakai, Yoshiyuki Nakao, Hiroki Kondo, Takashi Suzuki | 2004-06-15 |
| 6746957 | Manufacture of semiconductor device with copper wiring | Noriyoshi Shimizu | 2004-06-08 |
| 6420467 | Curable resin composition, adhesive composition, cured product and composite | Kinpei Iwata, Hideyuki Takahashi, Koichi Taguchi | 2002-07-16 |
| 6242808 | Semiconductor device with copper wiring and semiconductor device manufacturing method | Noriyoshi Shimizu, Hideki Kitada | 2001-06-05 |
| 6159854 | Process of growing conductive layer from gas phase | Yasuo Matsumiya, Kuninori Kitahara | 2000-12-12 |