HS

Hisaya Sakai

FL Fujitsu Semiconductor Limited: 8 patents #65 of 1,301Top 5%
Fujitsu Limited: 6 patents #5,180 of 24,456Top 25%
ST Sandisk Technologies: 2 patents #967 of 2,224Top 45%
FL Fujitsu Microelectronics Limited: 1 patents #212 of 624Top 35%
Overall (All Time): #270,689 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Showing 1–17 of 17 patents

Patent #TitleCo-InventorsDate
11756877 Three-dimensional memory device with via structures surrounded by perforated dielectric moat structure and methods of making the same Kazuto OHSAWA, Kota Funayama, Yoshitaka Otsu 2023-09-12
11152284 Three-dimensional memory device with a dielectric isolation spacer and methods of forming the same Jo SATO, Masanori Tsutsumi 2021-10-19
8546949 Semiconductor device having wirings formed by damascene Michio Oryoji 2013-10-01
8536708 Method of manufacturing a semiconductor device and semiconductor device Shinichi Akiyama, Kazuo Kawamura, Hirofumi Watatani, Kazuya Okubo 2013-09-17
8373274 Method of forming wiring structure and semiconductor device comprising underlying refractory metal layers Noriyoshi Shimizu 2013-02-12
8338953 Method of manufacturing a semiconductor device and semiconductor device Shinichi Akiyama, Kazuo Kawamura, Hirofumi Watatani, Kazuya Okubo 2012-12-25
8101513 Manufacture method for semiconductor device using damascene method Tsuyoshi Kanki, Nobuyuki Ohtsuka, Noriyoshi Shimizu 2012-01-24
8030207 Method of manufacturing a semiconductor device and semiconductor device Shinichi Akiyama, Kazuo Kawamura, Hirofumi Watatani, Kazuya Okubo 2011-10-04
7994055 Method of manufacturing semiconductor apparatus, and semiconductor apparatus Noriyoshi Shimizu 2011-08-09
7935624 Fabrication method of semiconductor device having a barrier layer containing Mn Nobuyuki Ohtsuka, Noriyoshi Shimizu, Yoshiyuki Nakao 2011-05-03
7906433 Semiconductor device having wirings formed by damascene and its manufacture method Michio Oryoji 2011-03-15
7579277 Semiconductor device and method for fabricating the same Tamotsu Owada, Shun-ichi Fukuyama 2009-08-25
7381643 Wiring structure forming method and semiconductor device Noriyoshi Shimizu 2008-06-03
7358180 Method of forming wiring structure and semiconductor device Noriyoshi Shimizu 2008-04-15
6992005 Semiconductor device and method of manufacturing the same Nobuyuki Ohtsuka, Noriyoshi Shimizu, Yoshiyuki Nakao, Hiroki Kondo, Takashi Suzuki 2006-01-31
6900542 Semiconductor device having increased adhesion between a barrier layer for preventing copper diffusion and a conductive layer, and method of manufacturing the same Noriyoshi Shimizu, Nobuyuki Ohtsuka 2005-05-31
6750541 Semiconductor device Nobuyuki Ohtsuka, Noriyoshi Shimizu, Yoshiyuki Nakao, Hiroki Kondo, Takashi Suzuki 2004-06-15