Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12335628 | Imaging condition setting system, imaging condition setting method, and program | Yosuke Naruse | 2025-06-17 |
| 11563380 | Power device drive apparatus and method for manufacturing the same | Shoji Saito | 2023-01-24 |
| 10763183 | Semiconductor device | Naohiro OGUSHI | 2020-09-01 |
| 10505518 | Semiconductor device with substrate temperature monitor circuit | Hideo KOMO, Takeshi Omaru | 2019-12-10 |
| 10438865 | Semiconductor device | Yuki Hata | 2019-10-08 |
| 7772295 | Resin compositions, cured article obtained therefrom, and sheet | Keiji Takano | 2010-08-10 |
| 6420467 | Curable resin composition, adhesive composition, cured product and composite | Nobuyuki Ohtsuka, Kinpei Iwata, Hideyuki Takahashi | 2002-07-16 |
| 6312552 | Curable resin composition, adhesive composition, bonded product, speaker and bonding method | Hiroshi Suto | 2001-11-06 |
| 6166146 | Curable resin composition, adhesive composition, bonded product, speaker and bonding method | Hiroshi Suto | 2000-12-26 |
| RE36140 | Two-part adhesive | Kinpei Iwata, Hideki Matsudo | 1999-03-09 |
| 5863989 | Curable resin composition | Hiroshi Suto | 1999-01-26 |
| 5504676 | Slip processing method processing data from slips with varying formats | Singi Domen, Kaori Kondoh, Koichi Yamano, Shinobu Koizumi, Rie Kobayashi +6 more | 1996-04-02 |
| 5330844 | Adhesive composition and metal-bonded composite | Kinpei Iwata | 1994-07-19 |
| 5328947 | Two-part adhesive | Kinpei Iwata, Hideki Matsudo | 1994-07-12 |