NI

Nobuhiro Imaizumi

Fujitsu Limited: 24 patents #1,085 of 24,456Top 5%
YA Yazaki: 10 patents #448 of 3,427Top 15%
Overall (All Time): #103,187 of 4,157,543Top 3%
34
Patents All Time

Issued Patents All Time

Showing 1–25 of 34 patents

Patent #TitleCo-InventorsDate
10283434 Electronic device, method for manufacturing the electronic device, and electronic apparatus Taiji Sakai, Seiki Sakuyama, Aki Dote 2019-05-07
10062658 Electronic component and electronic device Seiki Sakuyama, Toshiya Akamatsu, Keisuke Uenishi, Kenichi Yasaka, Toru Sakai 2018-08-28
10056342 Electronic component and electronic device Seiki Sakuyama, Toshiya Akamatsu, Keisuke Uenishi, Kenichi Yasaka, Toru Sakai 2018-08-21
9911642 Method of manufacturing an electronic device, and electronic device manufacturing apparatus Taiji Sakai 2018-03-06
9853014 Electronic component, electronic apparatus, and method of manufacturing electronic apparatus Ryo Kikuchi, Hiroshi Onuki 2017-12-26
9754904 Electronic apparatus and method for manufacturing electronic apparatus Masaru Morita 2017-09-05
9235001 Optical device and optical module Shigeaki Sekiguchi, Toshiya Akamatsu, Shinji Tadaki, Akinori Hayakawa 2016-01-12
9082756 Semiconductor device and power source device Kozo Shimizu, Keishiro Okamoto, Tadahiro Imada, Keiji Watanabe 2015-07-14
8922027 Electronic device having electrodes bonded with each other Taiji Sakai 2014-12-30
8728867 Semiconductor device, manufacturing method of semiconductor device, and power source device Kozo Shimizu, Keishiro Okamoto, Tadahiro Imada, Keiji Watanabe 2014-05-20
8673762 Solder, soldering method, and semiconductor device Toshiya Akamatsu, Seiki Sakuyama, Keisuke Uenishi, Tetsuhiro Nakanishi 2014-03-18
8674520 Semiconductor device, method for manufacturing the same, and power supply unit Keishiro Okamoto, Keiji Watanabe 2014-03-18
8492784 Semiconductor device and method for producing the same, and power supply Keishiro Okamoto, Tadahiro Imada, Keiji Watanabe 2013-07-23
8409931 Method of manufacturing semiconductor device Taiji Sakai, Masataka Mizukoshi 2013-04-02
7852439 Multi-layer display element and manufacturing method for the same Hisashi Yamaguchi, Fumio Yamagishi, Shigeo Matsunuma, Yoshikatsu Ishizuki, Taiji Sakai +1 more 2010-12-14
7816180 Method for processing a base that includes connecting a first base to a second base Masataka Mizukoshi, Yoshikatsu Ishizuki 2010-10-19
7811835 Method for processing a base that includes connecting a first base to a second base with an insulating film Masataka Mizukoshi, Yoshikatsu Ishizuki 2010-10-12
7514295 Method for processing a base that includes connecting a first base to a second base with an insulating film Masataka Mizukoshi, Yoshikatsu Ishizuki 2009-04-07
7402461 Method of connecting base materials Masataka Mizukoshi, Taiji Sakai 2008-07-22
6873056 Electrode-to-electrode bond structure Seiki Sakuyama, Tomohisa Yagi 2005-03-29
6869822 Method of making a semiconductor device with adhesive sealing subjected to two-fold hardening Tomohisa Yagi, Yasuhiro Usui, Kenji Fukuzono 2005-03-22
6790881 Adhesive composition Hiroaki Date, Tomohisa Yagi, Makoto Sasaki, Hideshi Tokuhira 2004-09-14
6670264 Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby Seiki Sakuyama, Tomohisa Yagi 2003-12-30
6576081 Adhesive, bonding method and assembly of mounting substrate Hiroaki Date, Yuko Motoyama, Hideshi Tokuhira, Makoto Usui 2003-06-10
6522935 Control-specification design management system used for load control devices Tatsuaki Oniishi 2003-02-18