Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10316439 | Crimped polyamide yarn, and woven or knit fabric employing same | Yasuhiro Shibata, Yosuke Matsuki, Hongchuan Jing | 2019-06-11 |
| 9957647 | False-twisted low-fused polyester yarn and multilayer-structure woven or knitted fabric | Naoki Oda, Tomoko Ito, Kouji Nishiya | 2018-05-01 |
| 9334588 | Three-dimension fabric | Tatsuya Kosui, Ryosuke Yamao, Hiroshi Tsuchikura | 2016-05-10 |
| 9315926 | Stretch fabric | Hiroshi Tsuchikura, Ryosuke Yamao, Shin Maezawa | 2016-04-19 |
| 8822013 | Woven fabric for swimsuits, and swimsuit | Ujiteru Niwa, Keiko Kasahara, Akira Watanabe | 2014-09-02 |
| 8191874 | Vehicle suspension system | Hirofumi Inoue, Kazuo Ogawa | 2012-06-05 |
| 8174525 | Tetrahedral mesh generating method for finite-element analysis and finite-element analyzing system using its method | Satoshi Kanai, Kenji Kishinami, Ichiro Nishigaki | 2012-05-08 |
| 7978470 | Electronic apparatus | Hiroki Uchida, Jun Taniguchi, Hideshi Tokuhira, Minoru Ishinabe, Masanobu Ishiduka | 2011-07-12 |
| 7958714 | False twisting yarn and production method thereof | Noboru Ueno | 2011-06-14 |
| 7943001 | Process for producing multilayer board | Takashi Nakagawa, Seiichi Sugano, Kenji Iida, Yasutomo Maehara, Hitoshi Suzuki +4 more | 2011-05-17 |
| 7610678 | Heat transfer sheet, heat transfer structural body and manufacturing method of the heat transfer structural body | Hideshi Tokuhira, Hiroki Uchida, Minoru Ishinabe | 2009-11-03 |
| 7551435 | Heat-absorbing member, cooling device, and electronic apparatus | Jun Taniguchi, Hiroki Uchida, Hideshi Tokuhira, Minoru Ishinabe, Masanobu Ishiduka +2 more | 2009-06-23 |
| 7502227 | Electronic apparatus | Hiroki Uchida, Jun Taniguchi, Hideshi Tokuhira, Minoru Ishinabe, Masanobu Ishiduka | 2009-03-10 |
| 7455320 | Shock absorbing steering apparatus | Kenji Imamura, Shigeru Hoshino, Kiminori Yoshino, Hideo Kondo, Junichi Nakano +1 more | 2008-11-25 |
| 7155914 | Cooling structure for electronic equipment | Minoru Ishinabe, Hiroki Uchida, Hideshi Tokuhira, Wataru Tanaka | 2007-01-02 |
| 6790881 | Adhesive composition | Tomohisa Yagi, Makoto Sasaki, Hideshi Tokuhira, Nobuhiro Imaizumi | 2004-09-14 |
| 6737108 | Microcapsulating conductive metal particles with polymerized monomers | Makoto Usui, Isao Watanabe, Yuko Hozumi | 2004-05-18 |
| 6576081 | Adhesive, bonding method and assembly of mounting substrate | Yuko Motoyama, Hideshi Tokuhira, Makoto Usui, Nobuhiro Imaizumi | 2003-06-10 |
| 6406746 | Microcapsulating conductive metal particles with polymerized monomers | Makoto Usui, Isao Watanabe, Yuko Hozumi | 2002-06-18 |
| 6080443 | Method for production of microcapsule type conductive filler | Makoto Usui, Isao Watanabe, Yuko Hozumi | 2000-06-27 |