Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119325 | Semiconductor device assemblies with molded support substrates | Fumitomo Watanabe, Masanori Yoshida | 2024-10-15 |
| 10998290 | Semiconductor device assemblies with molded support substrates | Fumitomo Watanabe, Masanori Yoshida | 2021-05-04 |
| 10607966 | Stacked semiconductor dies with selective capillary under fill | — | 2020-03-31 |
| 10553560 | Semiconductor device having multiple semiconductor chips laminated together and electrically connected | — | 2020-02-04 |
| 10217719 | Semiconductor device assemblies with molded support substrates | Fumitomo Watanabe, Masanori Yoshida | 2019-02-26 |
| 10083941 | Stacked semiconductor dies with selective capillary under fill | — | 2018-09-25 |
| 9935082 | Stacked semiconductor dies with selective capillary under fill | — | 2018-04-03 |
| 9466546 | Semiconductor device and method of forming the same | Koichi Hatakeyama, Keiyo Kusanagi | 2016-10-11 |
| 9112061 | Semiconductor device and method of forming the same | — | 2015-08-18 |
| 8816478 | Semiconductor device having penetration electrode penetrating through semiconductor substrate | Yoshiharu Kanegae, Hisashi Tanie, Keiyo Kusanagi | 2014-08-26 |
| 8810047 | Semiconductor device and method of manufacturing the same | Fumitomo Watanabe | 2014-08-19 |
| 8441126 | Semiconductor device | Ichiro Anjoh | 2013-05-14 |
| 8216934 | Semiconductor device suitable for a stacked structure | Eiji Yoshida, Takao Ohno, Yoshito Akutagawa, Koji Sawahata, Masataka Mizukoshi +2 more | 2012-07-10 |
| 8217517 | Semiconductor device provided with wire that electrically connects printed wiring board and semiconductor chip each other | Keiyo Kusanagi | 2012-07-10 |
| 8203222 | Semiconductor device and method of manufacturing the same | Koichi Hatakeyama, Keiyo Kusanagi | 2012-06-19 |
| 7993975 | Method of manufacturing semiconductor device including mounting and dicing chips | Fumitomo Watanabe | 2011-08-09 |
| 7969019 | Module with stacked semiconductor devices | Ichiro Anjoh | 2011-06-28 |
| 7964962 | Method of manufacturing a semiconductor apparatus | Ichiro Anjoh | 2011-06-21 |
| 7884459 | Semiconductor device suitable for a stacked structure | Eiji Yoshida, Takao Ohno, Yoshito Akutagawa, Koji Sawahata, Masataka Mizukoshi +2 more | 2011-02-08 |
| 7812439 | Semiconductor package with reduced length interconnect and manufacturing method thereof | Ichiro Anjo | 2010-10-12 |
| 7786564 | Semiconductor device and method for manufacturing semiconductor device | Ichiro Anjoh | 2010-08-31 |
| 7571538 | Vacuum fixing jig for semiconductor device | Kazuo Teshirogi, Yuzo Shimobeppu, Kazuhiro Yoshimoto, Yoshiaki Shinjo, Eiji Yoshida +1 more | 2009-08-11 |
| 7395847 | Jig for a semiconductor substrate | Kazuo Teshirogi, Yuzo Shimobeppu, Kazuhiro Yoshimoto, Yoshiaki Shinjo, Eiji Yoshida +1 more | 2008-07-08 |
| 7109561 | Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig | Kazuo Teshirogi, Yuzo Shimobeppu, Kazuhiro Yoshimoto, Yoshiaki Shinjo, Eiji Yoshida +1 more | 2006-09-19 |
| 6951800 | Method of making semiconductor device that has improved structural strength | Yoshiaki Shinjo, Yuzo Shimobeppu, Kazuo Teshirogi, Kazuhiro Yoshimoto, Eiji Yoshida +1 more | 2005-10-04 |