| 8222737 |
BGA semiconductor device having a dummy bump |
Yuji Watanabe, Hisashi Tanie, Koji Hosokawa, Mitsuaki Katagiri |
2012-07-17 |
$3,261,000 |
| 8164186 |
BGA semiconductor device having a dummy bump |
Yuji Watanabe, Hisashi Tanie, Koji Hosokawa, Mitsuaki Katagiri |
2012-04-24 |
$3,643,000 |
| 7812439 |
Semiconductor package with reduced length interconnect and manufacturing method thereof |
Mitsuhisa Watanabe |
2010-10-12 |
$3,573,000 |
| 7546506 |
DRAM stacked package, DIMM, and semiconductor manufacturing method |
Yuji Sonoda, Shuji Kikuchi, Katsunori Hirano, Mitsuaki Katagiri |
2009-06-09 |
|
| 7466577 |
Semiconductor storage device having a plurality of stacked memory chips |
Tomonori Sekiguchi, Hideki Osaka, Tatemi Ido, Osamu Nagashima, Mitsuaki Katagiri |
2008-12-16 |
|
| 7378333 |
Semiconductor device and manufacturing method thereof |
Toshiya Satoh, Masahiko Ogino, Tadanori Segawa, Yoshihide Yamaguchi, Hiroyuki Tenmei +2 more |
2008-05-27 |
$221,000 |
| 7119428 |
Semiconductor device |
Hisashi Tanie, Nae Hisano, Hiroyuki Ohta, Hiroaki Ikeda, Mitsuaki Katagiri +1 more |
2006-10-10 |
|
| 7057283 |
Semiconductor device and method for producing the same |
Kosuke Inoue, Hiroyuki Tenmei, Yoshihide Yamaguchi, Noriyuki Oroku, Hiroshi Hozoji +6 more |
2006-06-06 |
$120,000 |
| 6989600 |
Integrated circuit device having reduced substrate size and a method for manufacturing the same |
Masaharu Kubo, Akira Nagai, Osamu Kubo, Hiromi Abe, Hitoshi Akamine |
2006-01-24 |
$214,000 |
| 6949416 |
Method of manufacturing a semiconductor integrated circuit device |
Toshio Miyamoto, Asao Nishimura, Yoshihide Yamaguchi |
2005-09-27 |
$99,000 |
| 6946327 |
Semiconductor device and manufacturing method of that |
Toshio Miyamoto, Asao Nishimura, Mitsuaki Katagiri, Yuji Shirai, Yoshihide Yamaguchi |
2005-09-20 |
$82,000 |
| 6946723 |
Semiconductor device and manufacturing method thereof |
Toshiya Satoh, Masahiko Ogino, Tadanori Segawa, Yoshihide Yamaguchi, Hiroyuki Tenmei +2 more |
2005-09-20 |
$82,000 |
| 6940162 |
Semiconductor module and mounting method for same |
Shuji Eguchi, Akira Nagai, Haruo Akahoshi, Takumi Ueno, Toshiya Satoh +3 more |
2005-09-06 |
$84,000 |
| 6930388 |
Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure |
Yoshihide Yamaguchi, Hiroyuki Tenmei, Kosuke Inoue, Noriyuki Oroku, Hiroshi Hozoji +6 more |
2005-08-16 |
$86,000 |
| 6919622 |
Semiconductor device |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Asao Nishimura +19 more |
2005-07-19 |
$108,000 |
| 6861742 |
Wafer level chip size package having rerouting layers |
Toshio Miyamoto, Asao Nishimura, Mitsuaki Katagiri, Yuji Shirai, Yoshihide Yamaguchi |
2005-03-01 |
$144,000 |
| 6822317 |
Semiconductor apparatus including insulating layer having a protrusive portion |
Kosuke Inoue, Hiroyuki Tenmei, Yoshihide Yamaguchi, Noriyuki Oroku, Hiroshi Hozoji +6 more |
2004-11-23 |
|
| 6784541 |
Semiconductor module and mounting method for same |
Shuji Eguchi, Akira Nagai, Haruo Akahoshi, Takumi Ueno, Toshiya Satoh +3 more |
2004-08-31 |
$174,000 |
| 6770547 |
Method for producing a semiconductor device |
Kosuke Inoue, Hiroyuki Tenmei, Yoshihide Yamaguchi, Noriyuki Oroku, Hiroshi Hozoji +6 more |
2004-08-03 |
|
| 6720591 |
Semiconductor integrated circuit device |
Toshio Miyamoto, Asao Nishimura, Yoshihide Yamaguchi |
2004-04-13 |
|
| 6720208 |
Semiconductor device |
Gen Murakami, Kunihiro Tsubosaki, Masahiro Ichitani, Kunihiko Nishi, Asao Nishimura +19 more |
2004-04-13 |
|
| 6639323 |
Semiconductor device and its manufacturing method |
Yukiharu Akiyama, Tomoaki Kudaishi, Takehiro Ohnishi, Noriou Shimada, Shuji Eguchi +7 more |
2003-10-28 |
$159,000 |
| 6627997 |
Semiconductor module and method of mounting |
Shuji Eguchi, Akira Nagai, Haruo Akahoshi, Takumi Ueno, Toshiya Satoh +3 more |
2003-09-30 |
$211,000 |
| 6624504 |
Semiconductor device and method for manufacturing the same |
Kosuke Inoue, Hiroyuki Tenmei, Yoshihide Yamaguchi, Noriyuki Oroku, Hiroshi Hozoji +6 more |
2003-09-23 |
$204,000 |
| 6621154 |
Semiconductor apparatus having stress cushioning layer |
Toshiya Satoh, Masahiko Ogino, Tadanori Segawa, Takao Miwa, Akira Nagai +2 more |
2003-09-16 |
$216,000 |
