Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7535106 | Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate | Osamu Shiono, Takao Ishikawa, Takashi Namekawa, Yasutaka Suzuki, Takashi Naito +6 more | 2009-05-19 |
| 7378333 | Semiconductor device and manufacturing method thereof | Toshiya Satoh, Masahiko Ogino, Yoshihide Yamaguchi, Hiroyuki Tenmei, Atsushi Kazama +2 more | 2008-05-27 |
| 7217992 | Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device | Masahiko Ogino, Takumi Ueno, Shuji Eguchi, Akira Nagai, Toshiya Satoh +5 more | 2007-05-15 |
| 7183650 | Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate | Osamu Shiono, Takao Ishikawa, Takashi Namekawa, Yasutaka Suzuki, Takashi Naito +6 more | 2007-02-27 |
| 6946723 | Semiconductor device and manufacturing method thereof | Toshiya Satoh, Masahiko Ogino, Yoshihide Yamaguchi, Hiroyuki Tenmei, Atsushi Kazama +2 more | 2005-09-20 |
| 6888230 | Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device | Masahiko Ogino, Takumi Ueno, Shuji Eguchi, Akira Nagai, Toshiya Satoh +5 more | 2005-05-03 |
| 6621154 | Semiconductor apparatus having stress cushioning layer | Toshiya Satoh, Masahiko Ogino, Takao Miwa, Akira Nagai, Akihiro Yaguchi +2 more | 2003-09-16 |
| 6348741 | Semiconductor apparatus and a manufacturing method thereof | Masahiko Ogino, Takao Miwa, Toshiya Satoh, Akira Nagai, Akihiro Yaguchi +3 more | 2002-02-19 |
| 4965657 | Resin encapsulated semiconductor device | Masatsugu Ogata, Hidetoshi Abe, Shigeo Suzuki, Tatsuo Kawata | 1990-10-23 |
| 4933744 | Resin encapsulated electronic devices | Hiroshi Suzuki, Masahiro Kitamura, Shunichi Numata, Kunihiko Nishi | 1990-06-12 |