Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6774501 | Resin-sealed semiconductor device, and die bonding material and sealing material for use therein | Kazuhiko Kurafuchi, Naoya Suzuki, Masaaki Yasuda, Hiroyuki Sakai, Masao Kawasumi | 2004-08-10 |
| 6284818 | Encapsulant composition and electronic device | Hiroyuki Sakai, Terumi Tsukahara | 2001-09-04 |
| 6211277 | Encapsulating material and LOC structure semiconductor device using the same | Hiroki Sashima, Takaki Kashihara, Masanobu Fujii, Naoki Nara, Terumi Tsukahara +1 more | 2001-04-03 |
| 5567990 | Resin-encapsulated semiconductor device | Hiroshi Suzuki, Hiroki Sashima, Kazuhiko Miyabayashi, Osamu Horie | 1996-10-22 |
| 4965657 | Resin encapsulated semiconductor device | Masatsugu Ogata, Tadanori Segawa, Hidetoshi Abe, Shigeo Suzuki | 1990-10-23 |