Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6774501 | Resin-sealed semiconductor device, and die bonding material and sealing material for use therein | Kazuhiko Kurafuchi, Naoya Suzuki, Masaaki Yasuda, Tatsuo Kawata, Hiroyuki Sakai | 2004-08-10 |
| 5350811 | Epoxy resin and adhesive composition containing the same | Nobuo Ichimura, Mitsuo Yamazaki, Kohei Fujita, Hidetaka Satou, Yasuo Miyamoto +1 more | 1994-09-27 |
| 5258139 | Epoxy resin and adhesive composition containing the same | Nobuo Ichimura, Mitsuo Yamazaki, Kohei Fujita, Hidetaka Satou, Yasuo Miyamoto +1 more | 1993-11-02 |
| 5188767 | Electroconductive resin paste containing mixed epoxy resin and electroconductive metal powder | Mitsuo Yamazaki, Nobuo Ichimura, Yasuo Miyamoto, Koei Fujita | 1993-02-23 |