Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426164 | Semiconductor package | Masaya TOBA, Takashi Masuko, Kazuyuki MITSUKURA, Shinichiro Abe | 2025-09-23 |
| 12004305 | Wiring board and production method for same | Masaya TOBA, Takashi Masuko, Kazuyuki MITSUKURA, Shinichiro Abe | 2024-06-04 |
| 11990396 | Substrate and method for manufacturing the same | Kazuyuki MITSUKURA, Masaya TOBA, Yoshinori Ejiri | 2024-05-21 |
| 11979990 | Wiring board and method for manufacturing the same | Masaya TOBA, Takashi Masuko, Kazuyuki MITSUKURA, Shinichiro Abe | 2024-05-07 |
| 11562951 | Organic interposer and method for manufacturing organic interposer | Kazuyuki MITSUKURA, Masaya TOBA, Yoshinori Ejiri | 2023-01-24 |
| 11532588 | Copper paste for pressureless bonding, bonded body and semiconductor device | Hideo Nakako, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki KAWANA | 2022-12-20 |
| 11040416 | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device | Dai Ishikawa, Yuki KAWANA, Chie Sugama, Hideo Nakako, Yoshinori Ejiri | 2021-06-22 |
| 10930612 | Copper paste for pressureless bonding, bonded body and semiconductor device | Hideo Nakako, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki KAWANA | 2021-02-23 |
| 10756008 | Organic interposer and method for manufacturing organic interposer | Kazuyuki MITSUKURA, Masaya TOBA, Yoshinori Ejiri | 2020-08-25 |
| 10748865 | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device | Yuki KAWANA, Hideo Nakako, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri | 2020-08-18 |
| 10575402 | Resin composition, wiring layer laminate for semiconductor, and semiconductor device | Shinichiro Abe, Tomonori Minegishi, Kazuyuki MITSUKURA, Masaya TOBA | 2020-02-25 |
| 10566304 | Assembly and semiconductor device | Hideo Nakako, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki KAWANA | 2020-02-18 |
| 10388608 | Semiconductor device and method for manufacturing same | Kazuyuki MITSUKURA, Masaya TOBA, Kenichi IWASHITA, Kohsuke URASHIMA | 2019-08-20 |
| 10363608 | Copper paste for joining, method for producing joined body, and method for producing semiconductor device | Yuki KAWANA, Yoshinori Ejiri, Hideo Nakako, Chie Sugama, Dai Ishikawa | 2019-07-30 |
| 10034384 | Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition | Daisuke Fujimoto, Kunpei Yamada, Toshimasa Nagoshi | 2018-07-24 |
| 9661763 | Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition | Daisuke Fujimoto, Kunpei Yamada, Toshimasa Nagoshi | 2017-05-23 |
| 9075307 | Photosensitive resin composition for protective film of printed wiring board for semiconductor package | Toshizumi Yoshino, Hideyuki Katagi, Masaya Ookawa, Yoshiaki Fuse | 2015-07-07 |
| 6774501 | Resin-sealed semiconductor device, and die bonding material and sealing material for use therein | Naoya Suzuki, Masaaki Yasuda, Tatsuo Kawata, Hiroyuki Sakai, Masao Kawasumi | 2004-08-10 |
| 6256875 | Method for manufacturing semiconductor device | Masaki Watanabe, Akiyoshi Sawai, Yoshikazu Narutaki, Tomoaki Hashimoto, Masatoshi Yasunaga +3 more | 2001-07-10 |
| 6005289 | Package for semiconductor device laminated printed circuit boards | Masaki Watanabe, Akiyoshi Sawai, Yoshikazu Narutaki, Tomoaki Hashimoto, Masatoshi Yasunaga +3 more | 1999-12-21 |
| 5672965 | Evaluation board for evaluating electrical characteristics of an IC package | Hiroshi Seki, Mitsuyuki Takada | 1997-09-30 |
| 5410182 | High density semiconductor device having inclined chip mounting | Katsunori Ochi, Yoshiyuki Ishimaru, Kenji Kimura | 1995-04-25 |