Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354914 | Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formation | Yoshinori Ejiri, Hideo Nakako, Motoki YONEKURA, Shinichirou Sukata, Manabu Ishii +4 more | 2025-07-08 |
| 12131468 | Dynamic image analysis apparatus extracting specific frames including a detection target from a dynamic image, dynamic analysis system, and storage medium | Noritsugu Matsutani, Sumiya Nagatsuka | 2024-10-29 |
| 12109059 | Dynamic analysis system, correction apparatus, storage medium, and dynamic imaging apparatus | Sumiya Nagatsuka | 2024-10-08 |
| 12070800 | Electronic component and method for manufacturing electronic component | Yoshinori Ejiri, Shinichirou Sukata, Masaya TOBA, Hideo Nakako, Kosuke URASHIMA +5 more | 2024-08-27 |
| 11890681 | Method for producing bonded object and semiconductor device and copper bonding paste | Hideo Nakako, Motohiro NEGISHI, Chie Sugama, Yoshinori Ejiri, Yuichi Yanaka | 2024-02-06 |
| 11887960 | Member connection method | Motohiro NEGISHI, Hideo Nakako, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri | 2024-01-30 |
| 11676271 | Dynamic image analysis apparatus extracting specific frames including a detection target from a dynamic image, dynamic analysis system, and storage medium | Noritsugu Matsutani, Sumiya Nagatsuka | 2023-06-13 |
| 11575076 | Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module | Motohiro NEGISHI, Dai Ishikawa, Chie Sugama, Hideo Nakako, Yoshinori Ejiri | 2023-02-07 |
| 11532588 | Copper paste for pressureless bonding, bonded body and semiconductor device | Hideo Nakako, Kazuhiko Kurafuchi, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama | 2022-12-20 |
| 11483936 | Method for producing joined body, and joining material | Hideo Nakako, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Motohiro NEGISHI +1 more | 2022-10-25 |
| 11462502 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device | Hideo Nakako, Motohiro NEGISHI, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri | 2022-10-04 |
| 11370066 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device | Hideo Nakako, Motohiro NEGISHI, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri | 2022-06-28 |
| 11040416 | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device | Dai Ishikawa, Chie Sugama, Hideo Nakako, Yoshinori Ejiri, Kazuhiko Kurafuchi | 2021-06-22 |
| 10973490 | Radiation image photographing apparatus and radiation image photographing system for radiation image photographing process and dark image acquiring process | — | 2021-04-13 |
| 10930612 | Copper paste for pressureless bonding, bonded body and semiconductor device | Hideo Nakako, Kazuhiko Kurafuchi, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama | 2021-02-23 |
| 10769760 | Image processing apparatus and imaging apparatus that performs a distortion correction process | — | 2020-09-08 |
| 10748865 | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device | Hideo Nakako, Dai Ishikawa, Chie Sugama, Kazuhiko Kurafuchi, Yoshinori Ejiri | 2020-08-18 |
| 10566304 | Assembly and semiconductor device | Hideo Nakako, Kazuhiko Kurafuchi, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama | 2020-02-18 |
| 10363608 | Copper paste for joining, method for producing joined body, and method for producing semiconductor device | Kazuhiko Kurafuchi, Yoshinori Ejiri, Hideo Nakako, Chie Sugama, Dai Ishikawa | 2019-07-30 |
| 10335110 | Radiographic image capturing system and radiographic image capturing apparatus | Hideaki Tajima, Shugo Ishizaka | 2019-07-02 |