Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354914 | Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formation | Yoshinori Ejiri, Hideo Nakako, Yuki KAWANA, Shinichirou Sukata, Manabu Ishii +4 more | 2025-07-08 |
| 12070800 | Electronic component and method for manufacturing electronic component | Yoshinori Ejiri, Shinichirou Sukata, Masaya TOBA, Hideo Nakako, Yuki KAWANA +5 more | 2024-08-27 |
| 11512214 | Composition containing organic solvents with different vapor pressures, conductor made from composition, method for manufacturing conductor, and structure comprising conductor | Kohsuke URASHIMA, Yoshinori Ejiri, Takaaki NOHDOH, Ryuji Akebi | 2022-11-29 |