Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354914 | Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formation | Yoshinori Ejiri, Yuki KAWANA, Motoki YONEKURA, Shinichirou Sukata, Manabu Ishii +4 more | 2025-07-08 |
| 12233460 | Copper paste, wick formation method, and heat pipe | Toshiaki Tanaka, Dai Ishikawa, Yoshinori Ejiri, Michiko Natori | 2025-02-25 |
| 12070800 | Electronic component and method for manufacturing electronic component | Yoshinori Ejiri, Shinichirou Sukata, Masaya TOBA, Yuki KAWANA, Kosuke URASHIMA +5 more | 2024-08-27 |
| 11890681 | Method for producing bonded object and semiconductor device and copper bonding paste | Yuki KAWANA, Motohiro NEGISHI, Chie Sugama, Yoshinori Ejiri, Yuichi Yanaka | 2024-02-06 |
| 11887960 | Member connection method | Motohiro NEGISHI, Yuki KAWANA, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri | 2024-01-30 |
| 11575076 | Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module | Motohiro NEGISHI, Yuki KAWANA, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri | 2023-02-07 |
| 11532588 | Copper paste for pressureless bonding, bonded body and semiconductor device | Kazuhiko Kurafuchi, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki KAWANA | 2022-12-20 |
| 11483936 | Method for producing joined body, and joining material | Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki KAWANA, Motohiro NEGISHI +1 more | 2022-10-25 |
| 11462502 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device | Yuki KAWANA, Motohiro NEGISHI, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri | 2022-10-04 |
| 11370066 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device | Yuki KAWANA, Motohiro NEGISHI, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri | 2022-06-28 |
| 11040416 | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device | Dai Ishikawa, Yuki KAWANA, Chie Sugama, Yoshinori Ejiri, Kazuhiko Kurafuchi | 2021-06-22 |
| 10930612 | Copper paste for pressureless bonding, bonded body and semiconductor device | Kazuhiko Kurafuchi, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki KAWANA | 2021-02-23 |
| 10748865 | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device | Yuki KAWANA, Dai Ishikawa, Chie Sugama, Kazuhiko Kurafuchi, Yoshinori Ejiri | 2020-08-18 |
| 10566304 | Assembly and semiconductor device | Kazuhiko Kurafuchi, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki KAWANA | 2020-02-18 |
| 10363608 | Copper paste for joining, method for producing joined body, and method for producing semiconductor device | Yuki KAWANA, Kazuhiko Kurafuchi, Yoshinori Ejiri, Chie Sugama, Dai Ishikawa | 2019-07-30 |
| 10201879 | Silver paste composition and semiconductor device using same | Dai Ishikawa, Hiroshi Matsumoto, Michiko Natori, Toshiaki Tanaka | 2019-02-12 |
| 10174226 | Adhesive composition and semiconductor device using same | Toshiaki Tanaka, Michiko Natori, Dai Ishikawa, Hiroshi Matsumoto | 2019-01-08 |
| 9676969 | Composition set, conductive substrate and method of producing the same, and conductive adhesive composition | Kazunori Yamamoto, Yasushi Kumashiro, Shunya Yokosawa, Takaaki Noudou, Maki Inada +1 more | 2017-06-13 |
| 9550940 | Etching material | Yasushi Kumashiro, Takaaki Noudou, Maki Inada, Kyoko Kuroda | 2017-01-24 |
| 9457406 | Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition | Kazunori Yamamoto, Yasushi Kumashiro, Shunya Yokosawa, Katsuyuki Masuda, Yoshinori Ejiri +2 more | 2016-10-04 |
| 9051246 | Compound having trimethylene structure, polymer compound containing unit that has trimethylene structure, and reactive compound having trimethylene structure | Shigeaki Funyuu, Kenichi Ishitsuka, Sentaro Okamoto | 2015-06-09 |
| 8801971 | Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution | Kazunori Yamamoto, Yasushi Kumashiro, Youichi Machii, Shunya Yokozawa, Yoshinori Ejiri +1 more | 2014-08-12 |