Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9676969 | Composition set, conductive substrate and method of producing the same, and conductive adhesive composition | Hideo Nakako, Kazunori Yamamoto, Yasushi Kumashiro, Shunya Yokosawa, Takaaki Noudou +1 more | 2017-06-13 |
| 9550940 | Etching material | Hideo Nakako, Yasushi Kumashiro, Takaaki Noudou, Maki Inada | 2017-01-24 |
| 9457406 | Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition | Hideo Nakako, Kazunori Yamamoto, Yasushi Kumashiro, Shunya Yokosawa, Katsuyuki Masuda +2 more | 2016-10-04 |