Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9676969 | Composition set, conductive substrate and method of producing the same, and conductive adhesive composition | Hideo Nakako, Kazunori Yamamoto, Yasushi Kumashiro, Takaaki Noudou, Maki Inada +1 more | 2017-06-13 |
| 9457406 | Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition | Hideo Nakako, Kazunori Yamamoto, Yasushi Kumashiro, Katsuyuki Masuda, Yoshinori Ejiri +2 more | 2016-10-04 |