Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10328683 | Adhesive agent, adhesive material using the same, and method of use thereof | Masatoshi Yamaguchi, Eiichi Shinada, Takehiro FUKUYAMA, Yoshihiro Sakairi | 2019-06-25 |
| 10322572 | Adhesive agent, adhesive material using the same, and method of use thereof | Takehiro FUKUYAMA, Eiichi Shinada, Masashi Okoshi, Kazunori Yamamoto, Masatoshi Yamaguchi +3 more | 2019-06-18 |
| 9980143 | Communication system, base station, and terminal | Yuki Shinada, Noboru Hasegawa | 2018-05-22 |
| 9883427 | Wireless communication system and wireless communication method | Yuya Murakami, Kazunari Kobayashi | 2018-01-30 |
| 9457406 | Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition | Hideo Nakako, Kazunori Yamamoto, Yasushi Kumashiro, Shunya Yokosawa, Yoshinori Ejiri +2 more | 2016-10-04 |
| 9446576 | Adhesive agent, adhesive material using the same, and method of use thereof | Masatoshi Yamaguchi, Eiichi Shinada, Takehiro FUKUYAMA, Yoshihiro Sakairi | 2016-09-20 |
| 9386411 | Radio access system, controlling apparatus, and terminal apparatus | Takahiro Kawaguchi, Yutaka Hamada, Hiromitsu Kawai, Yuki Shinada | 2016-07-05 |
| 8956732 | Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board | Masaki Takeuchi, Kenichi Tomioka, Takako Ejiri | 2015-02-17 |
| 8815334 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board | Kenji Takai, Norio Moriike, Kenichi Kamiyama, Takako Watanabe, Shin Takanezawa +2 more | 2014-08-26 |
| 8801971 | Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution | Hideo Nakako, Kazunori Yamamoto, Yasushi Kumashiro, Youichi Machii, Shunya Yokozawa +1 more | 2014-08-12 |
| 8696929 | Polishing slurry and polishing method | Yasushi Kurata, Hiroshi Ono, Yasuo Kamigata, Kazuhiro Enomoto | 2014-04-15 |
| 8592546 | Silicon-containing alicyclic polyimide resin, polyamic acid resin, and manufacturing method for same | Tooru Kikuchi, Toshihiko Takasaki | 2013-11-26 |
| 8524921 | Liquid tetracarboxylic dianhydrides and process for the preparation thereof | Tooru Kikuchi, Hayato Kotani, Toshihiko Takasaki | 2013-09-03 |
| 8507100 | Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet | Kenji Tanaka, Kazumasa Takeuchi, Nobuyuki Ogawa | 2013-08-13 |
| 8501279 | Flexible laminate board, process for manufacturing of the board, and flexible print wiring board | Masahiko Suzuki, Kazuhito Obata, Kenichi Tomioka, Masaki Takeuchi, Sumio Yoshida +2 more | 2013-08-06 |
| 8486837 | Polishing slurry for metal, and polishing method | Hiroshi Ono, Masanobu Habiro | 2013-07-16 |
| 8236906 | Polyamide-imide resin, process for production of polyamide resin, and curable resin composition | Takako Ejiri | 2012-08-07 |
| 7964289 | Formation method of metal layer on resin layer, printed wiring board, and production method thereof | Kenji Takai, Norio Moriike, Kenichi Kamiyama, Kiyoshi Hasegawa | 2011-06-21 |
| 7947332 | Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board | Nozomu Takano, Kazumasa Takeuchi, Masashi Tanaka, Kazuhito Obata, Yuuji Ooyama +1 more | 2011-05-24 |
| 7871694 | Prepreg, metal-clad laminate and printed circuit board using same | Kazumasa Takeuchi, Makoto Yanagida, Masaki Yamaguchi | 2011-01-18 |
| 7862889 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board | Kenji Takai, Norio Moriike, Kenichi Kamiyama, Takako Watanabe, Shin Takanezawa +2 more | 2011-01-04 |
| 7818877 | Formation method of metal layer on resin layer | Kenji Takai, Norio Moriike, Kenichi Kamiyama, Kiyoshi Hasegawa | 2010-10-26 |
| 7758951 | Prepreg, metal-clad laminate and printed circuit board using same | Kazumasa Takeuchi, Makoto Yanagida, Masaki Yamaguchi | 2010-07-20 |
| 7648770 | Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet | Kenji Tanaka, Kazumasa Takeuchi, Nobuyuki Ogawa | 2010-01-19 |
| 7629045 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board | Kenji Takai, Norio Moriike, Kenichi Kamiyama, Takako Watanabe, Shin Takanezawa +2 more | 2009-12-08 |