Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12053820 | Dust core compound, molded body, and dust core | Arisa TAIRA, Chio Ishihara, Teruo ITOH, Kosuke URASHIMA | 2024-08-06 |
| 11732124 | Compound and tablet | Chio Ishihara, Hideo Maeda, Masahiko Osaka, Takashi Inagaki | 2023-08-22 |
| 10251265 | Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board | Akiko Kawaguchi, Nozomu Takano, Yasuyuki Mizuno, Shigeru Haeno, Yoshinori Nagai +1 more | 2019-04-02 |
| 9132611 | Resin composition, prepreg using same, metal foil with resin, adhesive film, and metal-clad laminate | — | 2015-09-15 |
| 8664534 | Printed wiring board | Nozomu Takano, Masaki Yamaguchi, Makoto Yanagida | 2014-03-04 |
| 8507100 | Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet | Kenji Tanaka, Nobuyuki Ogawa, Katsuyuki Masuda | 2013-08-13 |
| 8433236 | Paper processing apparatus and image forming apparatus | Terumitsu Azuma, Shigefumi Soga, Takeshi Hirabayashi, Kentaro Fukami, Daishi Watanabe +1 more | 2013-04-30 |
| 8196915 | Sheet returning unit for post processing apparatus | Takeshi Hirabayashi, Shigefumi Soga, Terumitsu Azuma, Kentaro Fukami, Shinji Tanoue +3 more | 2012-06-12 |
| 7947332 | Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board | Nozomu Takano, Katsuyuki Masuda, Masashi Tanaka, Kazuhito Obata, Yuuji Ooyama +1 more | 2011-05-24 |
| 7871694 | Prepreg, metal-clad laminate and printed circuit board using same | Makoto Yanagida, Masaki Yamaguchi, Katsuyuki Masuda | 2011-01-18 |
| 7758951 | Prepreg, metal-clad laminate and printed circuit board using same | Makoto Yanagida, Masaki Yamaguchi, Katsuyuki Masuda | 2010-07-20 |
| 7648770 | Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet | Kenji Tanaka, Nobuyuki Ogawa, Katsuyuki Masuda | 2010-01-19 |
| 7138174 | Prepreg and a laminated sheet | Yuko Tanaka | 2006-11-21 |
| 6475629 | Adhesive film formed of a siloxane-modified polyamideimide resin composition, adhesive sheet and semiconductor device | Tetsuya Saito, Ken Nanaumi | 2002-11-05 |
| 6252010 | Siloxane-modified polyamideimide resin composition, adhesive film, adhesive sheet and semiconductor device | Tetsuya Saito, Ken Nanaumi | 2001-06-26 |
| 6156870 | Resin composition which can be cured by application of heat or irradiation of light, film, laminate and production of multilayer wiring board | Masaki Morita, Shin Takanezawa, Takashi Yamadera, Shuuichi Hatakeyama | 2000-12-05 |
| 5532105 | Photolithographically viahole-forming photosensitive element comprising two photosensitive layers for the fabrication process of multilayer wiring board | Takashi Yamadera, Ritsuko Obata, Naoki Fukutomi, Kazuko Suzuki | 1996-07-02 |
| 4696704 | Material for lead frames | Takaharu Iwadachi, Kazuo Ikushima | 1987-09-29 |
| 4270845 | Laser apparatus for operations | Toshiaki Takizawa, Takashi Togo | 1981-06-02 |