Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12256490 | Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package | Mari SHIMIZU, Daisuke Fujimoto, Yasuo Kamigata, Tomohiko KOTAKE, Akira Shimizu +3 more | 2025-03-18 |
| 11581212 | Prepreg for coreless substrate, coreless substrate and semiconductor package | Hiroshi Yokota, Shintaro Hashimoto, Norihiko Sakamoto, Shinji Tsuchikawa, Katsuhiko Nawate | 2023-02-14 |
| 11432400 | Interlayer insulating film and method for producing same | Masaharu Matsuura, Nobuyuki Ogawa, Yasuyuki Mizuno | 2022-08-30 |
| 11401381 | Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same | Tomohiko KOTAKE, Masato Miyatake, Shunsuke Nagai, Shintaro Hashimoto, Yasuo Inoue +1 more | 2022-08-02 |
| 11319457 | Support-provided insulating layer, laminate, and wiring board | Masaki Morita, Konatsu Nakamura | 2022-05-03 |
| 10681807 | Coreless substrate prepreg, coreless substrate, coreless substrate manufacturing method and semiconductor package | Norihiko Sakamoto, Hiroshi Yokota, Shintaro Hashimoto, Katsuhiko Nawate, Shinji Tsuchikawa | 2020-06-09 |
| 10465089 | Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board | Kouji Morita, Hikari Murai, Yasuo Inoue, Kazunaga Sakai | 2019-11-05 |
| 10323126 | Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package | Tomohiko KOTAKE, Shunsuke Nagai, Shintaro Hashimoto, Shinichiro Abe, Masato Miyatake +1 more | 2019-06-18 |
| 10119047 | Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same | Tomohiko KOTAKE, Shinji Tsuchikawa, Hiroyuki Izumi, Masato Miyatake, Hikari Murai +1 more | 2018-11-06 |
| 9265145 | Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board | Kouji Morita, Hikari Murai, Yasuo Inoue, Kazunaga Sakai | 2016-02-16 |
| 9133308 | Resin composition, and printed wiring board, laminated sheet, and prepreg using same | Shunsuke Nagai, Masato Miyatake, Tomohiko KOTAKE, Shintaro Hashimoto, Yasuo Inoue +1 more | 2015-09-15 |
| 9079376 | Prepreg, laminate obtained with the same and printed-wiring board | Tomohiko KOTAKE, Masato Miyatake, Shunsuke Nagai, Hiroyuki Izumi, Shinji Tsuchikawa +1 more | 2015-07-14 |
| 9078365 | Resin composition, prepreg, laminate, and wiring board | Koji Morita, Kazunaga Sakai, Yuusuke Kondou | 2015-07-07 |
| 8815334 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board | Kenji Takai, Norio Moriike, Kenichi Kamiyama, Takako Watanabe, Koji Morita +2 more | 2014-08-26 |
| 8735733 | Resin composition, prepreg laminate obtained with the same and printed-wiring board | Masato Miyatake, Tomohiko KOTAKE, Shunsuke Nagai, Shintaro Hashimoto, Yasuo Inoue +1 more | 2014-05-27 |
| 7862889 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board | Kenji Takai, Norio Moriike, Kenichi Kamiyama, Takako Watanabe, Koji Morita +2 more | 2011-01-04 |
| 7740936 | Adhesion assisting agent fitted metal foil, and printed wiring board using thereof | Nobuyuki Ogawa, Hitoshi Onozeki, Takahiro Tanabe, Kenji Takai, Norio Moriike +2 more | 2010-06-22 |
| 7700185 | Insulation material, film, circuit board and method of producing them | Yasushi Kumashiro, Yoshitaka Hirata, Yasushi Shimada, Kazuhisa Otsuka, Hiroyuki Kuriya +1 more | 2010-04-20 |
| 7629045 | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board | Kenji Takai, Norio Moriike, Kenichi Kamiyama, Takako Watanabe, Koji Morita +2 more | 2009-12-08 |
| 7572503 | Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same | Koji Morita, Takako Watanabe, Toshihisa Kumakura, Hiroyuki Fukai, Hiroaki Fujita | 2009-08-11 |
| 6979712 | Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same | Koji Morita, Takako Watanabe, Toshihisa Kumakura, Hiroyuki Fukai, Hiroaki Fujita | 2005-12-27 |
| 6156870 | Resin composition which can be cured by application of heat or irradiation of light, film, laminate and production of multilayer wiring board | Masaki Morita, Takashi Yamadera, Kazumasa Takeuchi, Shuuichi Hatakeyama | 2000-12-05 |
| 5935452 | Resin composition and its use in production of multilayer printed circuit board | Teiichi Inada, Yoshiyuki Tsuru | 1999-08-10 |
| 5874009 | Multilayer printed circuit board with epoxy resin and carboxylated rubber as adhesive | Teiichi Inada, Yoshiyuki Tsuru | 1999-02-23 |
| 5419946 | Adhesive for printed wiring board and production thereof | Teturou Irino, Yuuji Toshaka, Takashi Kagaya | 1995-05-30 |