Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12168709 | Thermosetting resin composition, prepreg, laminate, metal-clad laminate, printed wiring board, and high-speed communication compatible module | Koji Morita, Ryo Shimokawa, Keiichi Kasuga, Chihiro Hayashi, Tomio Iwasaki | 2024-12-17 |
| 11581212 | Prepreg for coreless substrate, coreless substrate and semiconductor package | Hiroshi Yokota, Shintaro Hashimoto, Norihiko Sakamoto, Katsuhiko Nawate, Shin Takanezawa | 2023-02-14 |
| 11214660 | Prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrate | Yuma Yoshida, Yuichi Shimayama, Yukio Nakamura, Katsuhiko Nawate, Shintaro Hashimoto | 2022-01-04 |
| 10681807 | Coreless substrate prepreg, coreless substrate, coreless substrate manufacturing method and semiconductor package | Norihiko Sakamoto, Hiroshi Yokota, Shintaro Hashimoto, Katsuhiko Nawate, Shin Takanezawa | 2020-06-09 |
| 10604641 | Thermosetting resin composition and prepreg and laminate both made with the same | Masanori Akiyama, Tomohiko KOTAKE | 2020-03-31 |
| 10414943 | Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate | Yoshihiro Takahashi, Yasuo Kamigata, Hikari Murai, Masahiro Aoshima, Masato Miyatake +2 more | 2019-09-17 |
| 10119047 | Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same | Tomohiko KOTAKE, Hiroyuki Izumi, Masato Miyatake, Shin Takanezawa, Hikari Murai +1 more | 2018-11-06 |
| 9603244 | Thermosetting resin composition and prepreg and laminate obtained with the same | Tomohiko KOTAKE, Masanori Akiyama | 2017-03-21 |
| 9079376 | Prepreg, laminate obtained with the same and printed-wiring board | Tomohiko KOTAKE, Masato Miyatake, Shunsuke Nagai, Hiroyuki Izumi, Shin Takanezawa +1 more | 2015-07-14 |
| 8796473 | Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate | Masanori Akiyama, Hikari Murai | 2014-08-05 |
| 8461332 | Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate | Masanori Akiyama, Hikari Murai | 2013-06-11 |
| 7208539 | Thermosetting resin composition, and prepreg and laminated board using the same | Michitoshi Arata, Kenichi Tomioka, Kazuhito Kobayashi | 2007-04-24 |
| 7078106 | Thermosetting resin composition and use thereof | Kazuhito Kobayashi, Yasuyuki Mizuno, Daisuke Fujimoto, Nozomu Takano | 2006-07-18 |
| 6667107 | Thermosetting resin composition and use thereof | Kazuhito Kobayashi, Yasuyuki Mizuno, Daisuke Fujimoto, Nozomu Takano | 2003-12-23 |
| 5476690 | Process for preparing printed circuit board | Fumihiko Ohta, Takeshi Nojiri, Akio Nakano, Toshiaki Ishimaru, Hiroshi Yamazaki +3 more | 1995-12-19 |