Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581212 | Prepreg for coreless substrate, coreless substrate and semiconductor package | Hiroshi Yokota, Shintaro Hashimoto, Norihiko Sakamoto, Shinji Tsuchikawa, Shin Takanezawa | 2023-02-14 |
| 11214660 | Prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrate | Yuma Yoshida, Yuichi Shimayama, Yukio Nakamura, Shinji Tsuchikawa, Shintaro Hashimoto | 2022-01-04 |
| 10681807 | Coreless substrate prepreg, coreless substrate, coreless substrate manufacturing method and semiconductor package | Norihiko Sakamoto, Hiroshi Yokota, Shintaro Hashimoto, Shinji Tsuchikawa, Shin Takanezawa | 2020-06-09 |