Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7208539 | Thermosetting resin composition, and prepreg and laminated board using the same | Shinji Tsuchikawa, Kenichi Tomioka, Kazuhito Kobayashi | 2007-04-24 |
| 6696155 | Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substances | Nozomu Takano, Shigeo Sase, Tomio Fukuda | 2004-02-24 |
| 6692792 | Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances | Nozomu Takano, Shigeo Sase, Tomio Fukuda | 2004-02-17 |
| 6572968 | Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boards | Nozomu Takano, Shigeo Sase, Tomio Fukuda | 2003-06-03 |
| 6558797 | Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same | Nozomu Takano, Kazuhito Kobayashi | 2003-05-06 |
| 6462147 | Epoxy resin compositions for printed circuit board and printed circuit board using the same | Nozomu Takano, Tomio Fukuda, Kenichi Tomioka | 2002-10-08 |
| 6329474 | Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formaldehyde condensate and masked imidazole | Shigeo Sase, Nozomu Takano, Tomio Fukuda | 2001-12-11 |
| 6214468 | Flame retardant epoxy resin composition for printed board, and prepreg and metal foil clad laminate using the same | Nozomu Takano, Hikari Murai, Yoshiyuki Takeda | 2001-04-10 |
| 6180250 | Epoxy composition for printed circuit boards | Shigeo Sase, Nozomu Takano, Tomio Fukuda | 2001-01-30 |